2007
DOI: 10.1143/jjap.46.4179
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Effects of Silver Oxide Addition on the Electrical Resistivity and Microstructure of Low-Temperature-Curing Metallo-Organic Decomposition Silver Pastes

Abstract: The thermal decomposition of silver paste with the addition of a metallo-organic decomposition (MOD) compound generally requires a curing time of greater than 10 min and a curing temperature greater than 250 C, which does not meet the requirement for high-speed production in flexible substrates. In this study, attempts to modify the curing conditions of MOD silver pastes through the substitutions of silver flakes with silver(I) oxide (Ag 2 O) and silver(II) oxide (AgO) were performed. Differential thermal anal… Show more

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Cited by 30 publications
(19 citation statements)
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“…However, flexible substrates with low thermal conductivity can be subject to rupture or delamination of the formed structures. For silver sintering, due to the metal's high oxidation resistance and good electrical conduction even in oxidized states, simple thermal processes can be applied making the required sintering step to form uniform films of merged nanoparticles less demanding.…”
Section: The Printed Transparent Conductive Electrode In Organic Elecsupporting
confidence: 93%
“…However, flexible substrates with low thermal conductivity can be subject to rupture or delamination of the formed structures. For silver sintering, due to the metal's high oxidation resistance and good electrical conduction even in oxidized states, simple thermal processes can be applied making the required sintering step to form uniform films of merged nanoparticles less demanding.…”
Section: The Printed Transparent Conductive Electrode In Organic Elecsupporting
confidence: 93%
“…6,7 One technical challenge is that these polymer substrates cannot maintain their function and stabilities above 200℃; 8 however, such high temperatures are required for melting conventional lead-free solders. 9,10 Consequently, new solder materials and packaging protocols enabling low temperature bonding would be advantageous.…”
Section: Introductionmentioning
confidence: 99%
“…This reduction is possibly caused by the reduction of the Q-factor of the LC tank, due to the deterioration of the chip's interconnection (higher contact resistance between the NFC-chip and RF antenna through the silver-based isotropic conductive adhesive -ICA). Saline solution can interact with the ICA creating silver oxide which has a higher resistivity (in the order of 10 −3 Ω cm, compared to 10 −8 Ω cm for pure silver) [68,69] thus preventing a good contact to the chip. This impact can be alleviated and perhaps completely avoided by designing packaging configurations based on organic/in-organic layers (i.e., atomic layer deposited layers), as shown elsewhere in literature.…”
Section: Wwwadvmattechnoldementioning
confidence: 99%