2015
DOI: 10.1039/c5nr00312a
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Robust Ag nanoplate ink for flexible electronics packaging

Abstract: Nanoinks are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate ink amenable to very strong low temperature packaging, and investigated the relationship between bonding strength and electrical conductivity post-bonding. PVP shell plastic deformations observed in failure microcracks with the formation of PVP nanofibers, revealed bonding strength at low temperature… Show more

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Cited by 73 publications
(45 citation statements)
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References 40 publications
(85 reference statements)
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“…Li et al . reported the oxidation of PVP bonded with Ag starts from 250 °C and ended at ~400 °C, which is similar to our TG data41. Therefore, we reasoned that the first exothermic peak at ~327.3 °C is due to the decomposition of PVP in hydrothermal precursors.…”
Section: Resultssupporting
confidence: 90%
“…Li et al . reported the oxidation of PVP bonded with Ag starts from 250 °C and ended at ~400 °C, which is similar to our TG data41. Therefore, we reasoned that the first exothermic peak at ~327.3 °C is due to the decomposition of PVP in hydrothermal precursors.…”
Section: Resultssupporting
confidence: 90%
“…This result produced two consequences. Firstly, the PVP present at the interfaces between Ag NPs and PI can serve as a binder to provide robust bonding between the silver membrane and the substrate [20]. Secondly, however, the thin PVP that presented at the interfaces between Ag NPs can restrain the sintering of Ag NPs.…”
Section: Morphology and Characteristics Of Silver Membranementioning
confidence: 99%
“…Secondly, however, the thin PVP that presented at the interfaces between Ag NPs can restrain the sintering of Ag NPs. The direct interconnections of Ag NPs are limited, resulting in minor conduction passes for electrons passing through [20].…”
Section: Morphology and Characteristics Of Silver Membranementioning
confidence: 99%
“…However, some chemical contents in the traditional tin/lead solders are toxic [5][6][7] , which would affect people's health.…”
Section: Introductionmentioning
confidence: 99%