Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints

Li, Jingang; Ma, Xiaoqian; Zhou, Min-Bo; Ning, Xiang Liang; Zhang, Xin-Ping

doi:10.1109/icept.2018.8480722

Cited by 6 publications

(4 citation statements)

References 13 publications

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“…A large number of nano Bi particles began to precipitate in Sn matrix with the increase of temperature and strain rate. The effect of Sb element on the microstructure of Sn-58Bi was investigated by Li et al [62]. The test results are shown in Figure 6.…”

Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Zhang

Gao

et al. 2020

Science and Technology of Advanced Materials

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Section: Sn-bi Low Temperature Lead-free Soldermentioning

confidence: 99%

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Zhang

Gao

et al. 2020

Science and Technology of Advanced Materials

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“…Different types of studies have been done to find a way to increase the Sn-Bi solder alloy's reliability including adding alloying elements [19,20], microparticles [21,22], nanoparticles (NP) [23][24][25][26][27] and carbon nanotubes [28]. In the past, Ni [29], Sb [30], Cu and Zn [31] and Ag [32,33] have been added to the Sn-Bi solder joint.…”

Section: Introductionmentioning

confidence: 99%

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Bashir

Saad

Rizwan

et al. 2022

J Mater Sci: Mater Electron

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Due to the inherent environmental and health toxicities associated with lead, the use of environmental friendly lead-free solder materials has become an unavoidable trend in the electronic packaging industry. Sn-58Bi alloy is gaining attention for its good material properties such as low melting point, reliability and high tensile strength. The presence of the bismuth-rich phase increases the brittleness of Sn-58Bi alloy. The purpose of this study is to suppress the brittleness of Sn-58Bi alloy by the addition of different wt% (0, 10, 20, 30) of Sn powder. The powder metallurgy method was used to prepare the samples. Scanning electron microscopy and energy dispersive X-ray analysis were done to study the structural properties and a tensile test was done by a universal tensile machine to study the mechanical properties. The results reveal that the Sn particles partially dissolved in the Sn-58Bi solder matrix. The dissolution of Sn particles significantly improved the mechanical strength by 30%, suppressed the brittleness and improved the strain value by 1.3 times.

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“…The incorporation of alloying elements with minor amounts in Sn-Bi solders could refine the microstructure and improve their mechanical strength [17][18][19][20][21][22][23][24][25][26][27][28][29]. The Sn-Bi-Ag ternary alloys were fabricated and the Bi-rich phase was remarkably refined and uniformly dispersed in the matrix with the addition of 1.0 wt% Ag [19].…”

mentioning

confidence: 99%

“…Yang et al [23] reported that doping with Ni could effectively inhibit the growth of IMC layer between the Sn-Bi solder and the Cu substrate, maintaining the strength of the solder as a result. The effects of other elements such as Sb, In, Zn on the Bi-rich phase formation were investigated [24][25][26][27][28][29]. The results show that the Bi coarsening has been eliminated and the microstructure has been refined with a certain amount of these elements.…”

mentioning

confidence: 99%

Understanding the surface segregation of solute atoms in Sn-Bi–based solder from first principles

Sun¹,

Chen²,

Li³

et al. 2022

EPL

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Low temperature Sn-Bi solder has wide application in the field of electronic packaging due to its low melting point and good wettability. The formation of Bi-rich phase and intermetallic compound are the major concern for the reliability of Sn-Bi solder joints. We employed first-principles calculations to understand the segregation of Bi and the third elements to the surface of Sn. The effects of alloying elements on inhibiting the Bi surface segregation were described. Our calculations show that the Bi surface segregation could be effectively alleviated by the addition of Ag, Ga, Ni, and In, along with the reduction of further possible formation of intermetallic compound in the Sn-Bi-based solders. The results could be interpreted by the enhanced bond orders between Bi and its neighboring Sn, alloying elements.

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Effects of Sb addition on the microstructure and mechanical performance of Sn58Bi based alloys and the solder joints

Cited by 6 publications

References 13 publications

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Review of microstructure and properties of low temperature lead-free solder in electronic packaging

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint

Understanding the surface segregation of solute atoms in Sn-Bi–based solder from first principles

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