2008
DOI: 10.1016/j.nimb.2008.05.011
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Effects of process parameters on the synthesis of palladium membranes

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Cited by 11 publications
(6 citation statements)
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“…The authors reported hydrazine decomposition and Pd and Ag bulk precipitation beyond 60 C due to the instability of the electroless plating solution. Dogan and Kilicarslan [33] studied the process parameters on the synthesis of palladium membranes by electroless plating and reported a maximum in Pd deposition rate as a function of the bath temperature.…”
Section: Temperature Effectmentioning
confidence: 99%
“…The authors reported hydrazine decomposition and Pd and Ag bulk precipitation beyond 60 C due to the instability of the electroless plating solution. Dogan and Kilicarslan [33] studied the process parameters on the synthesis of palladium membranes by electroless plating and reported a maximum in Pd deposition rate as a function of the bath temperature.…”
Section: Temperature Effectmentioning
confidence: 99%
“…In both of electroless plating process and combined sol-gel process with electroless plating, the amount of palladium loaded was minimum at the first plating step for 45 o C of bath temperatures whereas the maximum value of palladium loading was obtained at the fifth plating step. The substrate dipped into the first plating bath had a large activated surface area [7]. When the surface area was considerably filled in the samples in which high mass gains were observed in the first plating step, it was seen that Pd amount deposited in the second until fifth steps increased.…”
Section: Resultsmentioning
confidence: 99%
“…In recent years, most published manuscripts use ammonium hydroxide and ethylenediaminetetraacetic acid to complex the palladium precursor. On the other hand, hydrazine is preferred as reducing agent due to the generation of nitrogen as unique by-product of the chemical reaction, avoiding other prohibited deposits in the film, i.e., phosphorous [157,159,160]. Hydrazine is a powerful reducing agent in both acid and alkaline media.…”
Section: Electroless Plating Standard Methodsmentioning
confidence: 99%