Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations

“…The Ref. [7] reported that since the solder paste extends along the periphery of the NSMD pads at the board side, it provides additional adhesion of solder along the circumference, known as the anchorage effect [42,43]. In investigation involving SMD pads, it is common to observe solder spreading solder mask on PCB although without the two bonding together.…”

“…In Fig. 5a, the failure mode observed was more progressive and gradual with almost clear separation of the bulk solder from the intermetallic compound at the substrate side after 3000 thermal cycles [42] cracked along the interface between the IMC and the solder bumps after being subjected to ATC and another solder joint cracked due to high-temperature excursions.…”

Effect of oxide thickness of solder powders on the coalescence of SnAgCu lead-free solder pastes

“…Researchers and electronic packaging manufactures have embarked on a series of studies on such crucial properties as particle size distribution, oxidation resistance as well as flux type, in order to improve the manufacture and reliability of solder pastes [4][5][6][7][8][9][10]. In particular, study on the surface oxidation is the key issue since oxidation not only wastes solder, but also results in poor solderability, which reduces the reliability of solder joints [2,4,6,11].…”

Effect of adding 0.3wt% Ni into the Sn–0.7wt%Cu solder

“…The term "wettability" defines the alloy performance and wetting conditions during soldering. Good wettability means uniform, smooth, unbroken and adherent coating of base metal whereas poor wettability represents the condition of poor wetting, non-wetting or partial wetting or dewetting [8]. It was also reported elsewhere [9] that cooling rate which is the most critical soldering parameters that affects the solidified microstructure can be influenced significantly by the wetting behavior of solder alloy.…”