Effects of polyester resin molecular weight on the performance of low temperature curing silver pastes

Liu, Chang; Fu, Qiangang; Zou, Jizhao; Huang, Yuanshan; Zeng, Xierong; Cheng, Biao

doi:10.1007/s10854-016-4593-3

Cited by 6 publications

(3 citation statements)

References 17 publications

(14 reference statements)

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“…The half-reaction of ascorbic acid is C 6 H 6 O 6 + 2H + +2e = C 6 H 8 O 6 . The reduction electrode potential of C 6 H 8 O 6 can be calculated by the following equation: E = E 0 − 0.059 pH [ 24 ]. Therefore, the reducing ability of ascorbic acid can be adjusted by changing the pH value, and the reducing ability of ascorbic acid increases with the increase of pH value.…”

Section: Resultsmentioning

confidence: 99%

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

Wan

et al. 2023

Materials

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In this paper, micro-size spherical silver particles were prepared by using a wet-chemical reduction method. The silver particles were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD) and a laser particle-size analyzer. The results indicate that different types and the content of surfactants can be used to prevent the accumulation, and control the morphology and particle size distribution, of silver particles. Moreover, the morphology of silver particles was changed from polyhedral to spherical when the pH was raised from 1 to 3. Under the optimal synthesis conditions (0.1 mol/L silver nitrate, 0.06 mol/L ascorbic acid, gelatin (5% by weight of silver nitrate), pH = 1), the micro-size spherical silver particles with diameter of 5–8 μm were obtained. In addition, the resistivity of conductive silver paste that prepared with the as-synthesized spherical silver particles was discussed in detail and the average resistivity of the conductive silver paste was 3.57 × 10−5 Ω·cm after sintering at 140 °C for 30 min.

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Section: Resultsmentioning

confidence: 99%

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

Wan

et al. 2023

Materials

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“…In this way the number of conductive network is increasing, leading to the rising of electrical conductivity. Liu C [18] synthesized the Ag paste by using 2µm Ag micron-akes and 20 nm Ag NPs, which has good conductivity of 3.673×10 − 5 Ω•cm. Jung [19] found that the mixed silver paste composed of Ag NPs and micron silver sheets had good adhesion and exibility, when the content of silver ake is 50%, the performance of silver paste is the best.…”

Section: Introductionmentioning

confidence: 99%

Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

Liu

Chen

et al. 2021

J Mater Sci: Mater Electron

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As an important interconnection material in electronics, conductive silver paste has attract much research interest in chip packaging and printed circuit board due to its predominant properties like high conductivity and exible interconnection. In this paper, the silver nanoparticles, the silver sphere particles and ake silver powder are fabricated by various methods. Different proportions of silver powder are selected to prepare micro-silver paste and mn silver paste (fabricated by silver nanoparticles : sphere particles : ake silver powder=1:1:1). Compared to traditional silver paste (containing 80wt% silver), the electrical resistivity of micro-silver paste containing 66.67wt% silver and cured at 200℃ for 45min in air is about (3.31±0.73)×10 -5 Ω•cm when the ratio of sphere particle to ake silver powder is 1:1, the resistance of silver paste doesn't also increase dramatically after bending ten times. The addition of nano-silver particles can reduce the resistivity in lower temperature curing. The folding endurance of mn silver paste is comparable to that of micro-silver paste with sphere : ake=1:1.

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“…The influence of matrix resin has also been studied. Studies have found that usually the film-forming resin is polyurethane, which has better electrical properties than epoxy resin [25][26][27]. The curing process [28] has also been studied.…”

Section: Introductionmentioning

confidence: 99%

Effect of Curing Agents on Electrical Properties of Low-Temperature Curing Conductive Coatings and Thermodynamic Analysis

et al. 2021

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Silver-based high-conductivity coatings are used in many advanced manufacturing equipment and components, and existing coatings require high-temperature curing. This paper studies the effects of different curing agents on the electrical properties of low-temperature curing (<100 °C) conductive coatings, and analyzes the effects of different curing temperatures and curing time on the surface resistance, square resistance and resistivity of conductive coatings. The response surface method in Design Expert was used to construct the model, and the curing thermodynamics of different curing agents were analyzed by DSC. It was found that curing agents with lower Tm and activation energy, higher pre-exponential factor and more flexible segments are beneficial to the preparation of highly conductive coatings.

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Effects of polyester resin molecular weight on the performance of low temperature curing silver pastes

Cited by 6 publications

References 17 publications

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

Effect of Curing Agents on Electrical Properties of Low-Temperature Curing Conductive Coatings and Thermodynamic Analysis

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