Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint

Kim, Kyoung-Ho; Seo, Wonil; Kwon, Sang-Hyun; Kim, Junki; Yoon, Jeong‐Won; Yoo, Sehoon

doi:10.5781/jwj.2017.35.3.1

Cited by 3 publications

(2 citation statements)

References 14 publications

(4 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…if an electroless Ni-P plating layer is coated on the BiTe-system thermoelement surface, the bonding strength is enhanced, but the wettability with the solder is not significantly improved. To improve these shortcomings, the electroless nickel electroless palladium immersion gold (eNe-Pig) surface treatment process that acts as a diffusion barrier and has superior wettability with lead-free solder was applied on the BiTe-system thermoelement and Cu electrode surface to improve the bonding strength [11][12][13][14][15][16].…”

Section: Introductionmentioning

confidence: 99%

“…To this end, eNePig plating was performed herein on a BiTe-system thermoelement and a Cu electrode substrate surface to inhibit the brittle intermetallic compound formation and obtain superior wettability with lead-free solder [11][12][13][14][15][16]. Furthermore, the bonding strength was compared with the existing electroless nickel (eN) process to investigate the effect of the eNePig on the bonding strength.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Archives of Metallurgy and Materials

Kim,

Bae,

Son

2021

View full text Add to dashboard Cite

EffEct of thE ENEPIG ProcEss oN thE BoNdING strENGth of Bite-BasEd thErmoElEctrIc ElEmENtsTo improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (eNePig) plating layers to ensure a stable bonding interface. if a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic compound. Therefore, the eNePig process was applied on the Cu electrode substrate. The bonding strength highly increased from approximately 10.4 to 16.4 mPa when eNePig plating was conducted to the BiTe-based thermoelectric element. when eNePig plating was performed to both the BiTe-based thermoelectric element and the Cu electrode substrate, the bonding strength showed the highest value of approximately 17.6 mPa, suggesting that the eNePig process is effective in ensuring a highly reliable bonding interface of the BiTe-based thermoelectric module.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Archives of Metallurgy and Materials

Kim,

Bae,

Son

2021

View full text Add to dashboard Cite

show abstract

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions

Son

et al. 2018

Journal of Welding and Joining

View full text Add to dashboard Cite

In this study, a new lead-free solder, Sn-0.7Cu-0.2Cr (wt.%) alloy, was developed. The mother alloy of Sn-0.7Cu-0.2Cr solder, which has melting temperature of about 231℃, was fabricated and then made by 300 um solder balls. To evaluate the thermo-mechanical reliability of the new solder alloy for automobile electronics, multiple reflows test was performed. As a result of the microstructure analysis, grain size increased with increasing reflow test. And microstructure of Sn-3.0Ag-0.5Cu solder was finest. It was also confirmed that the microstructure of Sn-0.7Cu-0.2Cr solder was finer than Sn-0.7Cu solder by Cr addition. The IMC thickness results show that the presence of Cr in solder inhibits the growth of interfacial Cu 6 Sn 5 layer and Cu 3 Sn layer. Specifically, the shear strength of the Sn-0.7Cu-0.2Cr/Cu solder joints increases by 9% and 22% than that of Sn-3.0Ag-0.5Cu and Sn-0.7Cu solder joints after 10 reflows test at 1m/s shear speed. And brittle fracture rate (%) of Sn-0.7Cu-0.2Cr was lower than Sn-3.0Ag-0.5Cu and Sn-0.7Cu solder after 10 reflows test at 1m/s shear speed.

show abstract

Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration

Kim

Hong

Nam

et al. 2021

Journal of Welding and Joining

View full text Add to dashboard Cite

With the development of the fine pitch technology, the size of the solder bumps contacting the chip and the substrate has decreased, thereby significantly increasing the current density. As a result, intermetallic compounds (IMCs) are formed in solder bumps, and the formation/growth of Kirkendall voids is the main reason for failure, which is accelerated by electromigration. Therefore, various studies have been conducted to restrain the growth of IMCs and Kirkendall voids. This study summarizes the issues that should be considered when investigating the effects of electromigration on solder joints. The prediction and observation of the growth behavior of the IMCs is summarized for various solder bump joints. In addition, we provide an effective method for assisting the fine pitch technology.

show abstract

Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint

Cited by 3 publications

References 14 publications

Archives of Metallurgy and Materials

Archives of Metallurgy and Materials

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions

Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration

Contact Info

Product

Resources

About