Abstract:EffEct of thE ENEPIG ProcEss oN thE BoNdING strENGth of Bite-BasEd thErmoElEctrIc ElEmENtsTo improve the mechanical performance of BiTe-based thermoelectric modules, this study applies anti-diffusion layers that inhibit the generation of metal intercompounds and an electroless nickel/electrode palladium/mission gold (eNePig) plating layers to ensure a stable bonding interface. if a plated layer is formed only on BiTe-based thermoelectric, the diffusion of Cu in electrode substrates produces an intermetallic co… Show more
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