Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

Zhang, Hao; Liu, Yang; Sun, Fenglian; Ban, Gaofang; Fan, Jiajie

doi:10.1108/mi-02-2016-0013

Cited by 10 publications

(5 citation statements)

References 20 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Sun et al [67] reported that nano-Cu particles could react with Sn to form stable Cu 6 Sn 5 IMC during reflow, which inhibited the spreading of the molten solder. Therefore, the spread ratio (SR) value of SnBi solder bearing Cu nanoparticles decreased with the increasing content of Cu nanoparticles.…”

Section: Wettabilitymentioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

View full text Add to dashboard Cite

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

show abstract

Section: Wettabilitymentioning

confidence: 99%

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

et al. 2019

View full text Add to dashboard Cite

show abstract

“…It will become the mainstream research direction to realize the low-temperature soldering between the heat sink substrate and the metal substrate of the packaged chip (Yao et al , 2017; Shen et al , 2019; Bhogaraju et al , 2020). Although Cu has better electrical and thermal conductivity than Al (Zhang et al , 2017a; Zhang et al , 2017b), and the mismatch of coefficient of thermal expansion between Cu and Si is smaller than that between Al and Si, the replacement of Al by Cu is due to cost factors such as high material price and upgrading of production equipment, so in some cases, Cu cannot completely replace Al. Therefore, the joint obtained by soldering Cu and Al can completely integrate the advantages of the two components, aiming to effectively lower the production cost and achieve outstanding performance.…”

Section: Introductionmentioning

confidence: 99%

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Huang

Gan

Liu

et al. 2023

View full text Add to dashboard Cite

Purpose This paper aims to investigate the effects of different ultrasonic-assisted loading degrees on the microstructure, mechanical properties and the fracture morphology of Cu/Zn+15%SAC0307+15%Cu/Al solder joints. Design/methodology/approach A new method in which 45 μm Zn particles were mixed with 15% 500 nm Cu particles and 15% 500 nm SAC0307 particles as solders (SACZ) and five different ultrasonic loading degrees were applied for realizing the soldering between Cu and Al at 240 °C and 8 MPa. Then, SEM was used to observe and analyze the soldering seam, interface microstructure and fracture morphology; the structural composition was determined by EDS; the phase of the soldering seam was characterized by XRD; and a PTR-1102 bonding tester was adopted to test the average shear strength. Findings The results manifest that Al–Zn solid solution is formed on the Al side of the Cu/SACZ/Al joints, while the interface IMC (Cu5Zn8) is formed on the Cu side of the Cu/SACZ/Al joints. When single ultrasonic was used in soldering, the interface IMC (Cu5Zn8) gradually thickens with the increase of ultrasonic degree. It is observed that the proportion of Zn or ZnO areas in solders decreases, and the proportion of Cu–Zn compound areas increases with the variation of ultrasonic degree. The maximum shear strength of joint reaches 46.01 MPa when the dual ultrasonic degree is 60°. The fracture position of the joint gradually shifts from the Al side interface to the solders and then to the Cu side interface. Originality/value The mechanism of ultrasonic action on micro-nanoparticles is further studied. By using different ultrasonic loading degrees to realize Cu/Al soldering, it is believed that the understandings gained in this study may offer some new insights for the development of low-temperature soldering methodology for heterogeneous materials.

show abstract

“…The addition of other alloying elements in Sn-Bi has gained traction for this purpose (Silva et al, 2017;Ribas et al, 2017;El-Daly and Ibrahiem, 2018). The low melting temperature of the eutectic Sn-Bi solder alloy can also be retained by the addition of a small amount of other alloying elements while refining the solder service performance (El-Daly and Ibrahiem, 2018;Zhang et al, 2017). This review analyzes and presents studies that have reported the effects of adding alloying elements to Sn-Bi alloys.…”

Section: Introductionmentioning

confidence: 99%

“…The Sn-Bi solder alloy system is a popular alloy composition because of its low melting temperature (139°C) (Mhd Noor et al , 2018; Zhang et al , 2017), impressive creep resistance, high hardness, good tensile strength and good joint strength. The low melting temperature of the alloy allows for fabrication of electrical components that are susceptible to overheating during soldering.…”

Section: Introductionmentioning

confidence: 99%

“…The growing trend of miniaturization of electric components precludes the use of heat sensitive materials that could deteriorate on exposure to high temperatures. Low energy consumption during soldering and suppressed loaded thermal stress of the solder joint are required of low melting temperature solder applications (Maruya et al , 2017; Zhang et al , 2017). The good creep resistance, and high tensile and joint strength properties of Sn-Bi contributes toward shelf life of solder joints.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

View full text Add to dashboard Cite

Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys. Design/methodology/approach A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder. Findings The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties. Originality/value This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

show abstract

Effects of nano-copper particles on the properties of Sn58Bi composite solder pastes

Cited by 10 publications

References 20 publications

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Contact Info

Product

Resources

About