Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability

Survey of Reliability Research on 3D Packaged Memory

“…The results show that such memory devices can operate normally in the temperature range of −55-125 • C, and they can withstand high-order mechanical stress and humidity, which far exceeds the resistance of industrial/commercial 3D packaging memory products. Dargines et al [145] conducted anti-radiation tests, such as TID (total ionization dose) and SEE (single-event effects), on 3D-Plus memory to evaluate the reliability of the device in space applications. The results show that the device could withstand a TID of 100 Krad (Si) and a SEE of 60 MeV/mg•cm 2 , meeting the requirements of relevant space applications.…”

“…Therefore, it is very essential to study the influence of two or more coupling loads on the reliability of 3D packaging devices. Based on the theory of elastic-plastic fracture mechanics, Fan et al [145] used a finite element simulation and numerical analysis to evaluate the influence of multiple cracks and thermal-mechanical coupling loads on the reliability of a TSV microstructure and studied the influence of crack number, crack location, crack length, crack direction, and thermal stress on crack growth. Han et al [146] used a finite element simulation to study the stress-strain distribution of 3D-packaging CSP solder joints under temperature-vibration coupling loads.…”

“…In Table 12, the most important research results on the reliability of 3D packaging memory under multi-stress coupling are summarized. Since thermal stress and mechanical stress are the two most important factors for the reliability of electronic components, [145][146][147][148] show that the reliability of 3D packaging memory under thermal-vibration coupling loads is a popular research topic. However, the fatigue life of solder joints under thermal stress and mechanical loading, for example, is not accurate according to the damage stacking method.…”

Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging

“…In recent years, microsystem technology has received more and more attention (Fan et al , 2022; Zhang et al , 2022). Microsystems that combine micromachining technology and integrated circuit technology have the advantages of miniaturization, integration, high density and low cost (Maity et al , 2022).…”