Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

Lu, Chun-An; Lin, Pang; Lin, Hong-Ching; Wang, Sea-Fue

doi:10.1143/jjap.45.6987

Cited by 33 publications

(17 citation statements)

References 8 publications

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“…In the printed electronics industry metal-organic compounds like silver stearate or silver oxalate are often added to be decomposed to form the silver bridge linking the micron-scale silver flakes [29]. Such an approach can also be used in the formulation of micron-scale Ag flakes as bonding materials but is not found in the literature.…”

Section: Micron-scale Ag Flakesmentioning

confidence: 99%

“…Others include Ag 2 CO 3 or silver lactate as reactive materials to be decomposed to reactive Ag to fill the porosity in the nano-scale Ag paste [41,76]. Such approaches have been reported earlier to bind adjacent micron-scale silver flakes with silver decomposed from metal-organic silver compounds like silver 2-ethylhexanoate or silver oxalate [29].…”

Section: Number Of Carbon Atomsmentioning

confidence: 99%

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Mechanical properties of nano-silver joints as die attach materials

Siow¹

2012

Journal of Alloys and Compounds

331

123

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Section: Micron-scale Ag Flakesmentioning

confidence: 99%

Section: Number Of Carbon Atomsmentioning

confidence: 99%

Mechanical properties of nano-silver joints as die attach materials

Siow¹

2012

Journal of Alloys and Compounds

331

123

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“…Submicron silver powder and flake production are a well‐established industrial process [16–18]. These flakes are used in a wide variety of applications, particularly in the electronics industry for producing electrically conductive adhesives (ECAs), conductive polymer thick films, shielding materials, and printing inks for microelectronics industry [19, 20].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of super water repellent silver flake/copolymer blend films and their potential as smart fabrics

2011

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A facile technique is demonstrated for the fabrication of super water repellent co‐polymer blend‐silver composite films from fatty acid surface functionalized fine silver flakes. Initially, high concentrations of surface functionalized silver flakes were dispersed in poly(vinyl chloride‐co‐vinyl acetate‐co‐vinyl alcohol) copolymer in solution to form electrically conducting adhesives/paints (ECAs) with a bulk resistivity of ∼3 × 10−5 Ω cm. The solvent‐borne ECAs were then blended with a water‐dispersed perfluoromethacrylate copolymer (Zonyl 8740) using a simple solvent‐inversion process to obtain super water‐repellent colloidal copolymer blend‐silver emulsions. The colloidal emulsions could be spray‐deposited on a number of fibrous substrates including fabrics and paper. A particular example is demonstrated herein by spray‐depositing these emulsions onto molten paraffin wax‐based laminates (60°C), which were partially impregnated into fabrics to fabricate highly water repellent, flexible, and thermoresponsive fabrics. A paraffin wax/polyolefin blend base film was used for the purpose. The surface topology of the superhydrophobic copolymer/silver composite films displayed fractal‐like hierarchical structures ideal for self‐cleaning hydrophobicity. On relatively low‐absorbent permeable porous surfaces such as cellulosic films (paper) impregnated with wax/polyolefin films, self‐cleaning ability of the coatings was maintained even for temperatures at which paraffin wax component of the laminated film was molten indicated by low‐water roll‐off angles. Hence, the composites have excellent compatibility with organic phase change materials such as paraffin wax and wax/polyolefin blends, and they can be used to fabricate nonwetting, thermoregulated, and electroactive fabrics. Antimicrobial properties of silver offer additional advantages for potential biomedical applications. POLYM. COMPOS., 2011. © 2011 Society of Plastics Engineers

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“…The MOD compounds are generally synthetic metallo-organic salts that decompose completely at low temperature to precipitate metal or oxide, depending on the metal and firing atmosphere. 1,2) A previous study 1) indicated that a paste containing 2-ethylhexanoate (C 8 H 15 O 2 Ag) has a very low decomposition temperature (190.3 C) among MOD agents, and it forms silver particles to promote the linking among silver flake particles and thus reduces the resistivity to <13 cm at temperatures as low as 200 C. However, the electrical resistivity of the metal film was affected by the connectivity of metal particles in addition to the surface roughness and porosity of the film, which resulted from the evaporation of organic matter at high temperature.…”

Section: Introductionmentioning

confidence: 99%

High-Frequency Electrical Properties of Silver Thick Films Measured by Dielectric Resonator Method

Lin¹,

Lin²,

et al. 2008

jjap

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The electrical properties of silver films, prepared using a low-curing-temperature metallo-organic-decomposition (MOD) paste and a high-temperature silver paste screen-printed on polished and nonpolished alumina substrates, at microwave frequency were characterized in this study. Surface resistance and effective conductivity of the silver films at microwave frequency (approximately 4 GHz) were evaluated using the TE 011 mode of the resonator cavities method. Devices of T-type resonator circuits were fabricated to determine the simulated and measured Q-values and to evaluate the effects of silver films and the surrounding substrate. The surface roughness of the fired films printed on nonpolished Al 2 O 3 substrate is slightly less than those on polished substrate, because the surface energy of the nonpolished alumina (29.81 mN/m) is slightly less than that of the polished alumina (36.69 mN/m). The calculated effective conductivities at 4.3 GHz are slightly less than the DC conductivities of the films. Moreover, the films prepared using the high temperature silver paste have higher electrical conductivity ranging from 4:08 Â 10 7 to 4:13 Â 10 7 S/m, since the high-temperature firing process leads to an improved connectivity of the silver particles. The results indicate that the films screen-printed on the polished substrate have a higher Q and a lower ÁQ value than those of films that are screen-printed on the nonpolished substrate. For the silver films prepared using the high-temperature silver paste, both the Q and ÁQ values were the highest among the films studied, which is consistent with the observation of the dense microstructure of the silver film and the interfacial reaction between the glass in the film and the substrate as a result of high firing temperature.

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Effects of Metallo-Organic Decomposition Agents on Thermal Decomposition and Electrical Conductivity of Low-Temperature-Curing Silver Paste

Cited by 33 publications

References 8 publications

Mechanical properties of nano-silver joints as die attach materials

Mechanical properties of nano-silver joints as die attach materials

Fabrication of super water repellent silver flake/copolymer blend films and their potential as smart fabrics

High-Frequency Electrical Properties of Silver Thick Films Measured by Dielectric Resonator Method

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