2007
DOI: 10.1063/1.2720090
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Effects of low-fluence swift iodine ion bombardment on the crystallization of ion-beam-synthesized silicon carbide

Abstract: Articles you may be interested inGrowth of silicon quantum dots by oxidation of the silicon nanocrystals embedded within silicon carbide matrix AIP Advances 4, 107106 (2014); 10.1063/1.4897378 Growth of silicon nanocrystallites in amorphous silicon carbide thin films by aluminum induced crystallization AIP Conf. Proc. 1536, 161 (2013); 10.1063/1.4810150 Influence of substrate temperature on growth of nanocrystalline silicon carbide by reactive magnetron sputtering J. Appl. Phys. 98, 024313 (2005); 10.1063/1.19… Show more

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Cited by 16 publications
(4 citation statements)
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“…In other word, if an electronic stopping power threshold for the formation of latent tracks in this material exists, it would be greater than 28 keV nm À1 . This result is not proper to Ti 3 SiC 2 since most of metals [46,47], but also some ceramics such as SiC [48][49][50] or TiC and TiSi 2 (secondary phases present in the samples, which do not seem to be affected by electronic interactions either) require huge electronic energy loss to be damaged by such interactions.…”
Section: Discussionmentioning
confidence: 50%
“…In other word, if an electronic stopping power threshold for the formation of latent tracks in this material exists, it would be greater than 28 keV nm À1 . This result is not proper to Ti 3 SiC 2 since most of metals [46,47], but also some ceramics such as SiC [48][49][50] or TiC and TiSi 2 (secondary phases present in the samples, which do not seem to be affected by electronic interactions either) require huge electronic energy loss to be damaged by such interactions.…”
Section: Discussionmentioning
confidence: 50%
“…[16], assuming that the absorption coefficient of the Cu Kα lines in SiC is 211 cm −1 . [17] The penetration depth for ω = 3 • , averaged over the range of the measured diffraction angles, is estimated to be 2.33 µm. The GIXRD measurements were repeated after each sequence of sample annealing.…”
Section: Methodsmentioning
confidence: 96%
“…The electrical resistivity method is also superior in measuring temperature with very low neutron fluences. For instance, the irradiation temperature was successfully estimated by electrical analysis of SiC with a neutron fluence of 1.5×10 17 n/cm 2 (E > 0.18 MeV), [11] whereas neutron fluences of > 1.5 × 10 19 n/cm 2 are usually required for the other methods based on structural changes in SiC, such as XRD. [3,4] Despite many advantages, the acquisition of irradiation temperature from a SiC monitor needs repetitive sample testing after sequential annealing processes.…”
Section: Introductionmentioning
confidence: 99%
“…In this regard, current research is focused on studying the effects of different dopants and radiation damages in doped silicon carbide materials. Even though a number of characteristic investigations on irradiated 6H-SiC have already been reported, detailed insight into the damage accumulation mechanism, due to fast moving ions at high-energy regions, has not been gathered. Furthermore, the mechanism of energy transfer and subsequent defect productions in a semiconductor are not clearly understood.…”
Section: Introductionmentioning
confidence: 99%