2012
DOI: 10.1007/s00339-012-7090-4
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Effects of liquid separation on the microstructure formation and hardness behavior of undercooled Cu–Co alloy

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Cited by 19 publications
(5 citation statements)
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“…As the liquid-phase separation process determines the final solidification structure, many studies have been carried out on it [1][2][3][4][5][6][7][8][9]. It turned out that the minor volume phase will generate in the form of droplets, and the structure evolution mainly involves nucleation and coagulation of the minor droplets due to Marangoni and Stokes motions.…”
Section: Introductionmentioning
confidence: 99%
“…As the liquid-phase separation process determines the final solidification structure, many studies have been carried out on it [1][2][3][4][5][6][7][8][9]. It turned out that the minor volume phase will generate in the form of droplets, and the structure evolution mainly involves nucleation and coagulation of the minor droplets due to Marangoni and Stokes motions.…”
Section: Introductionmentioning
confidence: 99%
“…The similar research conducted by Ma et al focused on adding graphene nanosheets (GNSs) into the Sn-58Bi solder, and the result revealed that mechanical properties and the microstructure of this synthesized solder were modified by 0.03 wt% GNSs addition during solid-state aging [21]. Besides, alloying copper substrate was another effective method to inhibit the formation of microvoids at the joint interface [22][23][24][25][26][27][28]. Zou et al have explored the influences of small amount of Ag, Al, Sn or Zn addition to Cu substrate on the microstructure evolution of the joint and found that these microelements could not only restrain the interfacial Bi segregation, but also reduce the formation of voids at the interface between the solder and substrate [29].…”
Section: Introductionmentioning
confidence: 88%
“…Microstructure formation in phase-separated Cu-Co alloys has been well documented. It is very sensitive to processing conditions such as liquid undercoolings and cooling rates [10][11][12]14,15,[17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35]. Electromagnetic levitation and glass-fluxing were used to undercool bulk Cu-Co alloys [8,15,[17][18][19]22,[24][25][26][27][28][29][30].…”
Section: Introductionmentioning
confidence: 99%
“…It is very sensitive to processing conditions such as liquid undercoolings and cooling rates [10][11][12]14,15,[17][18][19][20][21][22][23][24][25][26][27][28][29][30][31][32][33][34][35]. Electromagnetic levitation and glass-fluxing were used to undercool bulk Cu-Co alloys [8,15,[17][18][19]22,[24][25][26][27][28][29][30]. Accessed undercoolings often exceeded a critical value for triggering the metastable liquid phase separation.…”
Section: Introductionmentioning
confidence: 99%