Effects of lead on annealing properties of cold-drawn copper wire

An Evaluation Method for Tensile Characteristics of Cu/Sn IMCs Using Miniature Composite Solder Specimen

“…19 The results indicated that heat treatment at temperature above 450 K for 3 h decreases the initial tensile strength of copper by 45%. However, further decrease of the tensile strength does not occur even if the heat-treatment time is more than 3 h. This suggests that the Cu part of the RM layer has the same tensile strength because the heattreatment time for making all the MCS specimens was more than 3 h.…”

“…Namely, the 0.2% proof stress of the electroplated copper decreased by about 43% due to heat treatment, as for the hot-rolled copper wire. 19 In the case of zero heat-treatment time, Eq. 9 gives a 0.2% proof stress (r 0.2 ) of 162 MPa when setting t ht = 0.…”

Pure Copper and Dilute Copper Alloy Wires Being Controlled Trace Impurities and Additive Elements

“…デル試料である17 at ppm Pb, 18 at ppm S を含む棹銅を熱間 圧延した直径 8 mm の TPC ワイヤーロッドを用い，873 K,36 ks の 予 備 加 熱 を 施 し 直 径 2.6 mm に 伸 線 し T H を 調 べ た．その結果，予備加熱材の T H が 417 K であり，予備加熱 無しの場合の T H の 504 K に比べて 87 K 低下する大幅な再 結晶促進現象を確認した(30) ．Pb を 1 at ppm 以下，S を 20 at ppm 含む比較材の OFC では，予備加熱前後の T H がそれ ぞれ 509 K に対し 500 K であり，わずか 9 K の低下である．…”