Effects of small additions of lead, sulphur and oxygen on annealing characteristics of cold-drawn pure copper

Influence of Oxygen Content on the Static Recrystallization of ETP Copper

“…The oxygen effect in recrystallization behaviour is less clear but it was interpreted in terms of interactions of impurities with oxygen [1], although the mechanisms for the interaction of impurities with Cu 2 O are not clarified yet. Some researches have shown reactions between impurities and oxygen to form binary oxides, thereby resulting in a decrease of the solubility limits of impurities in the copper matrix [2]. Pops and Holloman [3] have reported that the role of oxygen is to decrease the activation energy of recrystallization that increases with impurity content and it is thought to accelerate the annealing process.…”

“…Pops and Holloman [3] have reported that the role of oxygen is to decrease the activation energy of recrystallization that increases with impurity content and it is thought to accelerate the annealing process. In general all previous research [4][5] focused on the mechanical properties and recrystallization behaviour concluded that oxygen plays a beneficial role in the recrystallization during annealing; this is contrary to impurities, which can significantly increase the dislocation density thus the elastic stored energy, delay recrystallization and will oftentimes control the mechanical properties and microstructures of the annealed wire [1][2][3][4][5][6]. In this context, it is important to get knowledge about the effect of oxygen at different steps of recrystallization: the nucleation and the grain growth.…”