Effects of Intermetallic Compound Formation in Al/Cu Clad Material Fabricated by Differential Speed Rolling

Abstract

In this study, the microstructure and mechanical property of Al/Cu clad material fabricated by differential speed rolling at room temperature were evaluated. Al and Cu plates were prepared and mechanically cladded at a differential speed ratio of 2:1 between the upper and lower rolls. Post- heat-treatment was carried out after the mechanical cladding at 400 °C for 60 min to induce the formation of intermetallic compound layers at the bonded interface of Al/Cu. As a result, differential speed rolling afforded a soundly cladded interface without any defects such as voids and cracks. In addition, intermetallic compound layers such as Al4Cu9 and Al2Cu were formed at the mechanically bonded interface during post-heat-treatment for 60 min, which led to an increase in Vickers microhardness value more than 30% relative to the base material. Therefore, we systematically explained the relationship between formation of intermetallic compounds and mechanical property of Al/Cu clad materials in this study.

Investigation on the coupling interaction in electron beam welded Al–Cu bimetallic sheet

“…According to the Al-Cu binary phase diagram as shown in Figure 4, there may form some intermetallic phases in the fusion zone and the interface zone during the welding process. The intermetallic phases could be mainly Al 4 Cu 9 , Al 2 Cu, and AlCu, 2,20,[24][25][26] which were highlighted in the diagram using the red lines C 1 , C 2 , and C 3 (Figure 4). As the temperature drops (548 C < T < 1083 C), based on the binary phase diagram, the Al 4 Cu 9 , Al 2 Cu, and AlCu could be formed in the molten pool.…”

The formation and growth of intermetallic compounds during interdiffusion of Al/Cu bimetals

“…It was found that Al 2 Cu, AlCu and Al 4 Cu 9 were formed at the interface after 2000 h of annealing at 150 o C. The same IMCs were also detected by F. Moisy et al [13] in the early stage of the reactive interdiffusion of CCA wires annealed at 300-350 o C using in-situ TEM. Only two IMCs (Al 2 Cu and Al 4 Cu 9 ) were found in Al/Cu clad material fabricated by differential speed rolling followed by a post heat treatment at 400 o C for 60 min [14]. Therefore, the types and amounts of IMCs at the Al/Cu interface are closely related to the preparation technology and the corresponding heat treatment.…”