Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

Goh, Yingxin; Haseeb, A.S.M.A.; Sabri, Mohd Faizul Mohd

doi:10.1016/j.electacta.2012.12.036

Cited by 69 publications

(33 citation statements)

References 27 publications

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“…The advantages of Sn-Bi solders include good joint strength, excellent creep resistance, low coefficient of thermal expansion, good wettability, and low cost. However, segregation problems are recognized as a potential disadvantage [3,4]. For low-temperature applications, Bi-Sn eutectic or near-eutectic compositions with or without additions of alloying elements are considered interesting possibilities.…”

Section: Introductionmentioning

confidence: 99%

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Silva

Reinhart

Nguyen-Thi

et al. 2015

Materials Characterization

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Section: Introductionmentioning

confidence: 99%

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Silva

Reinhart

Nguyen-Thi

et al. 2015

Materials Characterization

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“…For example, lead-free Sn-Cu and Sn-Cu-Bi layers are described in a US patent by Tsuji et al [30]. Other examples of Sn-Cu alloys electrodeposited from MSA are available [31][32][33][34], as are studies of Bi-Sn [35,36] and Sn-In [37].…”

Section: Electroplating Of Binary Metal Alloysmentioning

confidence: 99%

Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid

Walsh

León

2014

Surface and Coatings Technology

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Ever tightening environmental pressure together with the continued need for coatings able to meet challenging service environments have stimulated advances in coating technology. In the case of electrochemical techniques, the classical techniques of electrodeposition and anodising are being upgraded to meet the need for modern surface engineering coatings (including nanostructured films) on metals. A major challenge is to retain conventional processing, including aqueous solutions, simple power supplies and existing electrolyte tanks while using cost effective, 'green' electrolytes. One successful direction has been the emergence of electrolytes based on methanesulfonic acid, MSA which has good electrolytic conductivity and is capable of dissolving many metals as well as acting as a useful medium for dispersion of solids prior to electrophoretic coating. A range of application methods result, including electroplating, anodising and electrophoretic deposition from a stable, aqueous sol. A diverse range of coating materials is emerging, including metals, alloys, porous metal oxide films, conductive polymers and many composites. This review illustrates the usefulness and applications of MSA electrolytes using recent examples from the authors' laboratories and others. Developing coatings, including alternating multilayers of Sn and Cu, nanostructured metals, hierarchical pores, nanotubular metal oxides and graphene composites are briefly considered. This is a review with 94 references.

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“…Figure 6c) shows the surface microstructure and Figure 6d) the EDX analysis. Such deposits may find use in the electronics industry as leadfree solders 26 . , polypyrrole 28 and finely divided platinum 29 .…”

Section: Sn-cu-bi Ternary Alloy Depositsmentioning

confidence: 99%

Composite, multilayer and three-dimensional substrate supported tin-based electrodeposits from methanesulphonic acid

Walsh

Low

2016

Transactions of the IMF

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Tin and tin-alloy deposits enjoy many applications in the electronics, tribology and engineering industries with potential applications as electrodes for lithium batteries and as electrocatalyst coatings. Methanesulfonic acid has become a favoured electrolyte due to its environmental benefits and ability to offer a vehicle for many metal alloy, conductive polymer and composite coatings. A number of emergent uses require less common compositions or structures of alloy, polymer or composite deposits. This paper concisely provides diverse examples of modern tin-containing deposits from aqueous methanesulfonic acid, including Sn-Cu alloys having a very wide composition together with a wide range of colours (golden yellow-dark brown) and surface finishes, a Sn-Cu composite deposit containing ceramic, protonated titanium oxide nanotubes for batteries, a tincopper-bismuth ternary alloy and tin deposits supported on an inert reticulated vitreous carbon or carbon felt substrate to provide a porous, 3-dimensional tin surface for electrocatalysis and batteries.The importance of controlled current distribution and electrode/electrolyte movement are illustrated by the use of the rotating disc electrode (RDE), rotating cylinder electrode (RCE) and rotating cylinder Hull (RCH) cell.

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Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

Cited by 69 publications

References 27 publications

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy

Versatile electrochemical coatings and surface layers from aqueous methanesulfonic acid

Composite, multilayer and three-dimensional substrate supported tin-based electrodeposits from methanesulphonic acid

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