2014
DOI: 10.1109/tpel.2013.2288644
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Effects of Gate Field Plates on the Surface State Related Current Collapse in AlGaN/GaN HEMTs

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2014
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Cited by 98 publications
(46 citation statements)
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“…This type of field plate alleviates the high electric field formed at the edge of the gate by reducing the peak electric field as demonstrated by simulation data [8,11]. Applying field plates leads not only to an improved breakdown voltage but also to a reduction of the gate leakage current and the electron trapping, which, in turn, improves the current collapse performance [7,9,10].…”
Section: Introductionmentioning
confidence: 97%
“…This type of field plate alleviates the high electric field formed at the edge of the gate by reducing the peak electric field as demonstrated by simulation data [8,11]. Applying field plates leads not only to an improved breakdown voltage but also to a reduction of the gate leakage current and the electron trapping, which, in turn, improves the current collapse performance [7,9,10].…”
Section: Introductionmentioning
confidence: 97%
“…GaN-based high electron mobility transistors (HEMTs) have drawn considerable attention in the applications of microwave and power switching devices due to their excellent material properties such as high breakdown field, large carrier mobility, and high-density 2-dimensional electron gas (2DEG) at the heterojunction interface [1][2][3][4][5]. Such standard AlGaN/GaN HEMTs are naturally normally-on [6][7][8][9][10].…”
Section: Introductionmentioning
confidence: 99%
“…Additional application of the so-called field plate structure, provided even higher breakdown voltages and lower gate leakage currents [4]. On the other hand, one of the major drawbacks of these devices, known as dynamic on -resistance or current collapse phenomena, has been the topic of many research activities in the past couple of years and significant technological improvement has been obtained in this direction as well [5,6].…”
Section: Introductionmentioning
confidence: 99%