Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing

Zhang, Chun; Peng, Chaoqun; Feng, Yan; Zhang, Li

doi:10.1016/j.surfcoat.2015.07.059

Cited by 94 publications

(16 citation statements)

References 41 publications

(44 reference statements)

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“…Thus, the theoretical interfacial thermal resistance of the composites can be ultimately determined as 2.248×10 -9 m 2 KW -1 .The lowest value obtained from Hasselman-Johnson model increases by one order of magnitude, which indicate that the Hasselman-Johnson calculation model is reasonable. These results are in good agreement with previously reported data by Chun Zhang et al [19].…”

Section: Thermal Properties Of the Diamond/cu Compositessupporting

confidence: 94%

“…Evidently, the carbon of diamond interacts with the tungsten coatings to form tungsten semicarbide and monocarbide at temperatures ranging from 800 °C to 900 °C in the presence of vacuum of 10 -2 Pa for 90 min. This result is in line with the data from other literature [19].…”

Section: Xrd Analysissupporting

confidence: 94%

“…However, methods of reducing interfacial thermal resistance cannot realise the maximisation of thermophysical characteristics, because most additives remain in the copper matrix and form interfacial chemical reaction products between the diamond and copper matrix, thereby deteriorating the thermal properties of diamond/copper composites. To improve the wetting ability between liquid copper and diamond, diamond particles with coating such as Ti, Cr, Mo, B and W are modified by applying a molten salt route or diffusion method [17][18][19][20][21][22][23]. The intrinsic TC of the interfacial layer is another important factor in choosing carbide-forming elements.…”

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confidence: 99%

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Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration

Jia

Bai

Xiong

et al. 2019

Ceramics International

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Tungsten coatings were deposited on diamond particles by vacuum magnetron sputtering. The coated diamond particles were firstly heat treated at different temperatures, and diamond/copper (Cu) composites were fabricated by using a pressureless infiltration method afterwards. The influences of heat treatment on the microstructure and composition of tungsten based coating surface and diamond/copper composites were analyzed. Notable differences were found in the microstructure with heating temperatures. Moreover, the tungsten based coating surface contained large quantities of oxidized tungsten, and the phase composition of the coatings varied within the range of tungsten-W2C-WC as the heat treatment temperature increased. The fracture surface morphologies in the copper matrix composites reinforced with diamond particles with coatings were identically characterized with the presence of ductile fracture of matrix accompanied by dissociation of diamond particles from the matrix. The thermal conductivity (TC) and gas tightness behaviors of the diamond/copper composites were also explored. A maximum TC of 768 Wm -1 K -1 and a fine gas tightness of 2.5×10-10 Pam 3 /s were obtained with reinforcement of tungsten-coated diamond particles treated at 800 ℃. The value of the interface thermal resistance between copper and diamond particles was also estimated and specifically discussed.

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Section: Thermal Properties Of the Diamond/cu Compositessupporting

confidence: 94%

Section: Xrd Analysissupporting

confidence: 94%

mentioning

confidence: 99%

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Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration

Jia

Bai

Xiong

et al. 2019

Ceramics International

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“…Copper is the most widely used matrix material for heat sink applications due to its high thermal conductivity (400 Wm −1 K −1 ), high melting temperature, and good weldability [ 36 , 37 , 38 , 39 , 40 , 41 , 42 , 43 , 44 , 45 ]. To overcome the high coefficient of thermal expansion of copper, different reinforcements have been incorporated in the copper matrix, namely diamond particles [ 36 , 38 , 39 , 40 , 41 , 44 , 45 , 46 , 47 , 48 , 49 , 50 , 51 , 52 , 53 , 54 , 55 , 56 , 57 , 58 , 59 , 60 , 61 , 62 , 63 , 64 , 65 , 66 , 67 ], graphite (particles, fibers, or foam) [ 44 , 68 , 69 , 70 ], carbon fibers (CFs) [ 39 , 54 , 71 , 72 , 73 ], carbon nanotubes (CNTs) […”

Section: Metal Matrix Compositesmentioning

confidence: 99%

Metal Matrix Composite in Heat Sink Application: Reinforcement, Processing, and Properties

et al. 2021

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Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The ever-increasing performance of electronic systems together with miniaturization calls for better heat dissipation. Therefore, the heat sink materials should not only have high thermal conductivities, low densities, and cost, but also have coefficients of thermal expansion matching to those of semiconductor chips and ceramic substrates. As traditional materials fail to meet these requirements, new composite materials have been developed with a major focus on metal matrix composites (MMCs). MMCs can be tailored to obtain the desired combination of properties by selecting proper metallic matrix and optimizing the size and type, volume fraction, and distribution pattern of the reinforcements. Hence, the current review comprehensively summarizes different studies on enhancing the thermal performance of metallic matrices using several types of reinforcements and their combinations to produce composites. Special attention is paid to the types of commonly used metallic matrices and reinforcements, processing techniques adopted, and the effects of each of these reinforcements (and their combinations) on the thermal properties of the developed composite. Focus is also placed on highlighting the significance of interfacial bonding in achieving optimum thermal performance and the techniques to improve interfacial bonding.

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“…Apparently, the alloying elements inevitably diffuse into the copper matrix, which greatly reduces the TC of diamond-copper composites. Another method is to coat diamond with B [17,18], Ti [19,20], Cr [21,22], Mo [23,24,25,26], or W [27,28,29,30] by vacuum micro-deposition, molten salt bath, or magnetron sputter deposition. As W and Mo are not soluble in copper, the bonding forces with copper are less than that of Ti [31], Cr [22], and Zr.…”

Section: Introductionmentioning

confidence: 99%

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

Pan

Ren

et al. 2019

Materials

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In this study, diamond-copper composites were prepared with ZrC/Zr-coated diamond powders by spark plasma sintering. The magnetron sputtering technique was employed to coat the diamond particles with a zirconium layer. After heat treatment, most of the zirconium reacted with the surface of diamond and was transformed into zirconium carbide. The remaining zirconium on the zirconium carbide surface formed the outer layer. Owing to the method used to produce the ZrC/Zr-coated diamond in this study, the maximum thermal conductivity (TC) of 609 W·m−1·K−1 was obtained for 60 vol. % diamond-copper composites and the corresponding coefficient of thermal expansion (CTE) reached as low as 6.75 × 10−6 K−1. The bending strength of 40 vol. % ZrC/Zr-coated diamond-copper composites reached 255.95 MPa. The thermal and mechanical properties of ZrC/Zr-coated diamond-copper composites were substantially superior to those of uncoated diamond particles. Excellent properties can be attributed to the strengthening of the interfacial combination and the decrease in the interfacial thermal resistance due to the improvement associated with the ZrC/Zr coating. Theoretical analysis was also proposed to compare the thermal conductivities and CTE of diamond-copper composites fabricated with these two kinds of diamond powders.

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Effects of dual-layer coatings on microstructure and thermal conductivity of diamond/Cu composites prepared by vacuum hot pressing

Cited by 94 publications

References 41 publications

Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration

Effect of tungsten based coating characteristics on microstructure and thermal conductivity of diamond/Cu composites prepared by pressueless infiltration

Metal Matrix Composite in Heat Sink Application: Reinforcement, Processing, and Properties

Improvement of ZrC/Zr Coating on the Interface Combination and Physical Properties of Diamond-Copper Composites Fabricated by Spark Plasma Sintering

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