Metal Matrix Composite in Heat Sink Application: Reinforcement, Processing, and Properties

Abstract

Heat sinks are commonly used for cooling electronic devices and high-power electrical systems. The ever-increasing performance of electronic systems together with miniaturization calls for better heat dissipation. Therefore, the heat sink materials should not only have high thermal conductivities, low densities, and cost, but also have coefficients of thermal expansion matching to those of semiconductor chips and ceramic substrates. As traditional materials fail to meet these requirements, new composite materials have been developed with a major focus on metal matrix composites (MMCs). MMCs can be tailored to obtain the desired combination of properties by selecting proper metallic matrix and optimizing the size and type, volume fraction, and distribution pattern of the reinforcements. Hence, the current review comprehensively summarizes different studies on enhancing the thermal performance of metallic matrices using several types of reinforcements and their combinations to produce composites. Special attention is paid to the types of commonly used metallic matrices and reinforcements, processing techniques adopted, and the effects of each of these reinforcements (and their combinations) on the thermal properties of the developed composite. Focus is also placed on highlighting the significance of interfacial bonding in achieving optimum thermal performance and the techniques to improve interfacial bonding.

Equivalent Thermal Conductivity of Topology-Optimized Composite Structure for Three Typical Conductive Heat Transfer Models

“…In addition, the conductive heat transfer models of the abovementioned composite materials and experimental test methods mainly consider the heat conduction between two specific planes within a specific distance, which corresponds to the basic definition of thermal conductivity. For different composite material application scenarios, such as heat conduction/dissipation in electronic devices [11] and conductive heat regeneration in solid-state caloric cooling devices [12], there will be different conductive heat transfer models and requirements. The methods of heat transfer enhancement and heat transfer capability evaluation will also be different.…”

Thermal Characterization of Metal-Diamond Composite Heat Spreaders Using Low-Frequency-Domain Thermoreflectance

“…The increasing need for more compact, higher-efficiency, high-power electronic devices has led to higher-power densities. Without addressing thermal management, this will cause higher operating temperatures and reduced reliability. , For example, the GaN-on-SiC HEMT power densities as high as 40 W/mm have been demonstrated . However, even at 8 W/mm, the peak channel temperature can exceed 340 °C, which reduces lifetime to lower than 10 4 h .…”

“…Without addressing thermal management, this will cause higher operating temperatures and reduced reliability. 1 , 2 For example, the GaN-on-SiC HEMT power densities as high as 40 W/mm have been demonstrated. 3 However, even at 8 W/mm, the peak channel temperature can exceed 340 °C, 4 which reduces lifetime to lower than 10 4 h. 5 At least 50% of device failures are related to thermal issues, 1 , 2 , 6 making thermal management a crucial but often overlooked aspect of device design.…”

“… 1 , 2 For example, the GaN-on-SiC HEMT power densities as high as 40 W/mm have been demonstrated. 3 However, even at 8 W/mm, the peak channel temperature can exceed 340 °C, 4 which reduces lifetime to lower than 10 4 h. 5 At least 50% of device failures are related to thermal issues, 1 , 2 , 6 making thermal management a crucial but often overlooked aspect of device design. Recently, improved heat spreading at the package level has been increasingly in focus, especially the carrier (flange) onto which the semiconductor die is attached.…”

Thermal Conductance of Copper–Graphene Interface: A Molecular Simulation

“…By incorporating a reinforcement phase with a low density and low expansion coefficient into the conventional metallic heat dissipation material, a metal matrix composite possesses high thermal conductivity and a low expansion coefficient as a typical thermal management composite material [ 4 , 5 ]. Metal matrix composites (MMCs) have been used for a variety of industrial applications, especially thermal management devices and aerospace materials [ 6 , 7 , 8 , 9 ]. Copper is a good composite matrix due to its excellent thermal conductivity, high melting temperature (1083 °C), good chemical stability, and corrosion resistance [ 10 ].…”