Effects of Doping Profile on GaAs, Double-Drift IMPATT Diodes at 33 and 44 GHz Using the Energy-Momentum Transport Model

El-Gabaly, M.; Mains, R. K.; Haddad, G.I.

doi:10.1109/tmtt.1984.1132847

Cited by 7 publications

(1 citation statement)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…We suppose that we can analyze the DAR diode structure on the basis of precise nonlinear drift-diffusion model of the IMPATT diode which had been developed for DDR type of IMPATT diode (Zemliak et al 1997;Zemliak & De La Cruz, 2002) and was used successfully for the active layer optimization of this type of the diode. Historically, many analytical and numerical models have been developed for the various operational modes of IMPATT diodes (Tager & Vald-Perlov, 1968;Scharfetter & Gummel, 1969;Zemliak, 1981;Kafka & Hess, 1981;El-Gabaly et al, 1984;Zemliak & Zinchenko, 1989;Dalle & Rolland, 1989;Zemliak & Roman, 1991;Vasilevskii, 1992;Stoiljkovic et al, 1992;Curow, 1994;Joshi et al, 1995;Tornblad et al, 1996;Zemliak et al, 1997). However, they are some problems with numerical scheme stability for any complex doping profile of IMPATT diode.…”

Section: Introductionmentioning

confidence: 99%

Micro Electronic and Mechanical Systems

Takahata¹

2009

View full text Add to dashboard Cite

and 2005, respectively. He held industrial research positions with Panasonic in Japan and 3M in USA, conducting R&D of micro devices and fabrication technologies for over ten years. Presently, he is an Assistant Professor at the University of British Columbia, Canada, as well as a Canada Research Chair. Prof. Takahata has published many papers and holds several issued patents in MEMS and micro/nanofabrication. He has served on committees for international conferences such as the IEEE MEMS and the IEEE Transducers. He also served as the editor of an InTech book Micro Electronic and Mechanical Systems. His research interests are in the areas of MEMS, nanotechnology, and micro/nanomanufacturing, including wireless microdevices, bioMEMS, nanomaterials and microstructures integration, and microplasma control and application. PrefaceThe miniaturization and performance improvement in semiconductor devices and integrated circuits (ICs) are expected to continue through leveraging of nanotechnologies and nanomaterials. This evolution should accelerate the System-on-a-Chip (SoC) trend, i.e., singlechip integration of multifunctional, mixed-signal electronic components, toward realizing embedded nanoelectronic systems. In parallel with advances in electronics, we are witnessing the rise of micro-electro-mechanical systems (MEMS), with rapidly growing commercial opportunities and markets extending to a broader range of industrial sectors on a global scale.The emergence of MEMS is primarily attributed to the establishment of sophisticated IC manufacturing techniques and processes that served as a foundation for realizing many innovative silicon-based micromachining technologies. Advances in this area have brought about a revolution in mechanical engineering, enabling the miniaturization and system-level integration of mechanical structures and devices with ICs on a chip for MEMS fabrication. With miniaturized sensors and actuators, MEMS provide us with the ability to interact with micro-scale environments with non-electrical/-electronic parameters, found in the mechanical, optical, chemical, biological, and other domains. This exceptional ability has led to their application in fields ranging from implantable medical sensors to video game controllers. There is no doubt that continued development of MEMS and microsystems with electromechanical functionalities will extend their contribution to society, in parallel with the evolution of IC technologies.This book discusses key aspects of these technology areas, organized in twenty-seven chapters that present the latest research developments in micro electronic and mechanical systems. The book addresses a wide range of fundamental and practical issues related to MEMS, advanced metal-oxide-semiconductor (MOS) and complementary MOS (CMOS) devices, SoC technology, integrated circuit testing and verification, and other important topics in the field. Several chapters cover state-of-the-art microfabrication techniques and materials as enabling technologies for the microsystems. Reliabili...

show abstract