Effects of coupling agents on the properties of epoxy-based electrically conductive adhesives

Thermal conductivity of epoxy adhesive enhanced by hybrid graphene oxide/AlN particles

“…The reliability of electronic device is dependent exponentially on the operating temperature, whereby a small increase in operating temperature ($10-15°C) can lead to a twofold decrease in the lifespan [3]. The stability of the electronic devices will be decreased by 10% per 2°C rise when they are working in a long time [4]. As a result, the heat dissipation has become an important issue, suggesting that the packing materials should have high thermal conductivity and ideal physical, chemical properties [2].…”

Preparation and performance of Ag-coated Cu flakes filled epoxy as electrically conductive adhesives

“…The electricity properties of the ECAs filled with 70 wt % Agcoated Cu flakes untreated and modified by SCA were presented in Figure 2 would benefit for Ag-coated Cu flakes' wettability and dispersity in resin. SCA is usually used for improving inorganic fillers' dispersion in polymer, because of their two different functional groups, one attached to polymer and the other attracted to fillers [13][14][15]. The SCA functioned as molecular bridges here at the interface of polymer binder and Ag coated Cu fillers, resulting in the formation of covalent chemical bonds across the interface.…”

Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research

“…The use of silane coupling agents for enhanced adhesion is widely used in the 0924-4247/$ -see front matter © 2011 Elsevier B.V. All rights reserved. doi:10.1016/j.sna.2011.06.008 microelectronic industry either as functionalised surfaces, or as additives in epoxies [11][12][13][14][15][16].…”