Thermal conductivity of epoxy adhesive enhanced by hybrid graphene oxide/AlN particles

Yuan, Wenhui; Li, Li; Xu, Tao

doi:10.1016/j.applthermaleng.2016.06.089

Cited by 77 publications

(39 citation statements)

References 43 publications

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“…However, high specific surface area of graphene would cause agglomeration of graphene particles during the mixing procedure, resulting in disruption of 3D conductive networks. At this moment, BN plays a major role and suppresses the aggregation of graphene and serves as heat conducting bridges between graphene and epoxy . Boron nitride paticle reduces the interfacial thermal resistance of whole adhesive system by increasing the contact area between graphene and epoxy resin.…”

Section: Introductionmentioning

confidence: 46%

“…Owing to the high aspect ratio and surface area, graphene tends to form irreversible agglomerates. The presence of BN particle suppresses the aggregation of graphene which facilitates the formation of thermal conductive path …”

Section: Resultsmentioning

confidence: 99%

“…Similar findings were also observed by Yuan et al where T c of 2.77 W/mK was achieved by the addition of 6 wt% of GO and 50 wt% of BN composite . The authors reported that the 2D‐planar structure of graphene creates a significant contact area with the BN particles because of both the top and bottom surfaces of a graphene are in close contact with the BN particles serving as heat conducting bridges between 3D BN particles.…”

Section: Resultsmentioning

confidence: 99%

“…Many researchers have extensively studied the thermal conductivity of epoxy adhesives filled with various conductive fillers in recent years. Yuan et al synchronized AlN particles, graphite and graphene oxide (GO), taking advantage of the “synergistic effects” occurring between fillers to prepare thermal conductive adhesives . The authors reported that the T c of the adhesives were higher when larger AlN particles were used.…”

Section: Introductionmentioning

confidence: 99%

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Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Singh

Panda

Mohanty

et al. 2017

Polymers for Advanced Techs

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In the present study, the synergistic effect of hybrid boron nitride (BN) with graphene on the thermal conductivity of epoxy adhesives has been reported. Graphene was prepared by chemical reduction of graphite oxide (GO) in a mixture of concentrated H2SO4/H3PO4 acid. The particle size distribution of GO was found to be ~10 μm and a low contact angle of 54° with water indicated a hydrophilic surface. The structure of prepared graphene was characterized by Fourier transform infrared (FTIR), X‐ray diffraction (XRD), Raman spectroscopy and atomic force microscopy (AFM). The thermal conductivity of adhesives was measured using guarded hot plate technique. Test results indicated an improvement in the thermal conductivity up to 1.65 W/mK, which was about ninefold increase over pristine epoxy. Mechanical properties of different epoxy formulations were also measured employing lap shear test. The surface characterization of different epoxy adhesive systems was characterized through XRD, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) studies. Fourier transform infrared also served to determine the nature of interactions between filler particles and epoxy resin. Non‐isothermal differential scanning calorimetric (DSC) technique was used to investigate the effects of graphene and BN particles on the cure kinetics and cross‐linking reaction of epoxy cured with amine curing agent. The Kissinger equation, the model‐free isoconversional Flynn–Wall–Ozawa method and the Ozawa model were used to analyze the kinetic parameter. Copyright © 2017 John Wiley & Sons, Ltd.

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Section: Introductionmentioning

confidence: 46%

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Singh

Panda

Mohanty

et al. 2017

Polymers for Advanced Techs

View full text Add to dashboard Cite

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“…A feasible way to address the thermal issue of devices is to improve thermal conductivity of polymers by adding high thermal conductivity inorganic fillers . Thermally conductive ceramic fillers such as AlN, Al 2 O 3 , SiC, Si 3 N 4 , and BN powders are added to the polymer matrices to modify their thermal conductivity . Boron nitride (BN) has caught great interest because of its high thermal conductivity, superior chemical stability, electrical insulation properties, a large band gap, lack of toxicity, light weight, medium price, and outstanding high temperature resistance …”

Section: Introductionmentioning

confidence: 99%

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

Yao

Wang

Chen

et al. 2019

Polymers for Advanced Techs

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DOPO and boron nitride (BN) fillers with different particle sizes and several loadings were employed to improve the properties of cyanate ester (CE) resin. The effects of BN content and particle size on the thermal conductivity of the BN‐DOPO/CE ternary composites were discussed. The influence of enhancing the thermal conductivity of the ternary composites on their flame retardancy was studied. The consequences showed that increasing the thermal conductivity of BN‐DOPO/CE composites had an active impact on their flame retardancy. Approving flame retardancy of the ternary composites was certified by the high limiting oxygen index (LOI), UL‐94 rating of V‐0, and low heat release rate (HRR) and total heat release (THR). For instance, in contrast with pure CE matrix, peak of HRR (pk‐HRR), average of HRR (av‐HRR), THR, and average of effective heat of combustion (av‐EHC) of CEP/BN0.5 μm/10 composite were decreased by 51.7%, 33.8%, 18.7%, and 18.9%, respectively. Thermal gravimetry analysis (TGA) showed that the addition of BN fillers improves the thermal stability of the composites. Moreover, the ternary composites possess good dielectric properties. Their dielectric constants (ε) are less than 3, and dielectric loss tangent (tgδ) values are lower than neat CE resin.

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Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

Barani

Mohammadzadeh

Geremew

et al. 2019

Adv Funct Materials

217

160

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The thermal properties of epoxy‐based binary composites comprised of graphene and copper nanoparticles are reported. It is found that the “synergistic” filler effect, revealed as a strong enhancement of the thermal conductivity of composites with the size‐dissimilar fillers, has a well‐defined filler loading threshold. The thermal conductivity of composites with a moderate graphene concentration of fg = 15 wt% exhibits an abrupt increase as the loading of copper nanoparticles approaches fCu ≈ 40 wt%, followed by saturation. The effect is attributed to intercalation of spherical copper nanoparticles between the large graphene flakes, resulting in formation of the highly thermally conductive percolation network. In contrast, in composites with a high graphene concentration, fg = 40 wt%, the thermal conductivity increases linearly with addition of copper nanoparticles. A thermal conductivity of 13.5 ± 1.6 Wm−1K−1 is achieved in composites with binary fillers of fg = 40 wt% and fCu = 35 wt%. It has also been demonstrated that the thermal percolation can occur prior to electrical percolation even in composites with electrically conductive fillers. The obtained results shed light on the interaction between graphene fillers and copper nanoparticles in the composites and demonstrate potential of such hybrid epoxy composites for practical applications in thermal interface materials and adhesives.

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Thermal conductivity of epoxy adhesive enhanced by hybrid graphene oxide/AlN particles

Cited by 77 publications

References 43 publications

Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Synergistic effect of hybrid graphene and boron nitride on the cure kinetics and thermal conductivity of epoxy adhesives

Synergetic effect of thermal conductivity and flame retardancy of cyanate ester composites containing DOPO and BN with great dielectric properties

Thermal Properties of the Binary‐Filler Hybrid Composites with Graphene and Copper Nanoparticles

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