2019
DOI: 10.1016/j.addma.2018.11.005
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Effects of cold plasma treatment on interlayer bonding strength in FFF process

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Cited by 18 publications
(9 citation statements)
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“…As it was mentioned earlier, mechanical anisotropy in parts printed by FDM could go as high as 50% depending on the layer size such as thickness, width, or diameter. Reports showed that FDM produced parts have also weaker thermal and electrical conductivity properties towards build orientation than other orientations [ 27 , 28 , 29 , 30 ].…”
Section: Materials Anisotropy In Additively Manufactured Polymer Partsmentioning
confidence: 99%
See 1 more Smart Citation
“…As it was mentioned earlier, mechanical anisotropy in parts printed by FDM could go as high as 50% depending on the layer size such as thickness, width, or diameter. Reports showed that FDM produced parts have also weaker thermal and electrical conductivity properties towards build orientation than other orientations [ 27 , 28 , 29 , 30 ].…”
Section: Materials Anisotropy In Additively Manufactured Polymer Partsmentioning
confidence: 99%
“…Although the deposition lines can be integrated into adjacent lines, inter and intralayer deformation occurs in the form of cracks between the cylindrical lines. The extruded material cools quickly from melting to printer chamber temperature, resulting in the development of inner stresses responsible for the weak bond between two deposition lines, which causes the delamination or part fabrication failure [ 1 , 17 , 30 ]. This structure inhomogeneity results in impaired mechanical strengths in the part produced via FDM.…”
Section: Materials Anisotropy In Additively Manufactured Polymer Partsmentioning
confidence: 99%
“…With the rapid development of 3D printing technology, the application of 3D printing technology is increasingly extensive [1][2][3]. Due to the demand for individuation, color 3D printing technology has developed rapidly recently [4,5].…”
Section: Introductionmentioning
confidence: 99%
“…There are many approaches designed, many of them requiring hardware modifications in the 3D printers. Thus, [40] suggests low-temperature plasma to activate the sublayer. In [41] a laser is proposed to preheat the filament, and in [42] the laser was used to preheat the sublayer, and in [43] the sublayer was heated with infrared source.…”
Section: Introductionmentioning
confidence: 99%