Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

Gao, Feng; Takemoto, Tadashi; Nishikawa, Hiroshi

doi:10.1016/j.msea.2006.01.032

Cited by 181 publications

(89 citation statements)

References 18 publications

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“…The addition of minor alloying elements for the suppression of interfacial IMC growth has been widely studied [10][11][12][13][14][15][16] . Kotadia et al studied the addition of 0.5-1.5 mass% Zn to SnAgCu solder 17) .…”

Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

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A comparative study of the formation, growth, and morphology of the interfacial intermetallic compounds (IMCs) of the eutectic Sn-Bi and Sn-Bi-Zn solder joints was conducted, and the shear strengths of the two solder joints were evaluated. The cross-sectional microstructures of the joints were investigated and the fracture surfaces of the joints were examined after the shear tests. The results of the microstructural analysis of the joints indicated that the addition of Zn suppressed the growth of the interfacial IMCs signi cantly after both re ow and thermal aging. Although the shear-test results indicated that the addition of Zn decreased the shear strength of the Sn-Bi solder joint, the fracture surface examination after the shear tests revealed the cause of the degradation of the shear strength and a possible solution to prevent this degradation is suggested in the paper.

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Section: Introductionmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

et al. 2016

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“…Therefore, Ni atoms substitute Cu atoms in Cu 6 Sn 5 and create (Cu, Ni) 6 Sn 5 at the interfaces and in the solder bulk [31]. Gao et al have shown, based on thermodynamic calculation, that (Cu, Ni) 6 Sn 5 is more stable than Cu 6 Sn 5 [32] . Yu et al have also obtained the similar results [33].…”

Section: Discussionmentioning

confidence: 99%

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

et al. 2015

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The characteristics of interfacial intermetallic compounds (IMCs) can have serious impact on the reliability of solder joints. In this study, Ni nanoparticles (NPs) were added to SAC305 solder/Cu substrate interface by flux mixing. The effects of Ni NP addition on electromigration (EM) under high current density were investigated. EM tests with a maximum duration of 1128 h were conducted under a current density of 1 9 10 4 A/cm 2 , at 80 ± 3°C on the solders prepared using 0 and 2 wt% Ni NPs-doped flux. At 2 wt% Ni NPs addition to flux, the growth rate of interfacial IMC at the anode side decreased by more than five times. No significant change in electrical resistance was observed in 2 wt% samples for up to 1128 h. Ni NP addition at the solder/substrate through flux mixing is, therefore, expected to lead to more reliable solder joints.

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“…The IMCs promote the bonding between the solder alloys and Cu [16 and 23]. [19] reported that Cu 6 Sn 5 intermetallic was formed during soldering and Cu 3 Sn was formed during solid-state ageing between Cu 6 Sn 5 and Cu substrate. It is clear that the thickness of IMCs is established by the relative movement of two interfaces; IMCs/liquid solder and solid/IMCs [21].…”

Section: Interfacial Propertiesmentioning

confidence: 99%

WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS

Erer¹

2017

NWSA

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The wetting behavior and interfacial properties of molten SAC300, SAC305 and SAC0307 (Sn-Ag-Cu) Pb-free solder alloys were investigated by sessile drop technique at various temperatures (250, 280 and 310°C) on Cu substrate in Ar atmosphere, as well as its dependence on time. The contact angles of the Pb-free solder alloys on Cu substrate do not decrease sharply with increasing temperature but change with time. The contact angles were measured for SAC305, SAC300 and SAC0307 alloys and the lowest θ was obtained as 41.90°for SAC305 alloy at 310°C. The melting temperatures were examined which for SAC305 Pb-free alloy is lower than those for SAC300, SAC0307 Pb-free alloys. The formation of intermetallic compounds (IMC) between the Pbfree solder alloys and the Cu substrate was observed.

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Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing

Cited by 181 publications

References 18 publications

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Effect of Zn Addition on Interfacial Reactions Between Sn-Bi Solder and Cu Substrate

Reduction of electromigration damage in SAC305 solder joints by adding Ni nanoparticles through flux doping

WETTING BEHAVIORS AND INTERFACIAL PROPERTIES OF SAC300, SAC305 AND SAC0307 TERNARY Pb-FREE SOLDER ALLOYS

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