1986
DOI: 10.1109/edl.1986.26412
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Effects of a buried p-layer on alpha-particle immunity of MESFET's fabricated on semi-insulating GaAs substrates

Abstract: Abstuact-Measurements of alpha-particle-induced charge are carried out for the first time on both conventional MESFET's fabricated directly on semi-insulating GaAs substrates and MESFET's with a buried p-layer. The maximum collected charge is found to be 65 fC in the MESFET's with a buried p-layer, one order smaller than in conventional MESFET's.

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Cited by 23 publications
(5 citation statements)
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“…Assuming that the incident beam enters the crystal at an incident angle of O", the penetration depth of the 2.0 and the 5. 4 MeV beam would be 5.4 and 20.4 pm, respectively. Fig.…”
Section: I-u and C-u Measurementsmentioning
confidence: 99%
See 1 more Smart Citation
“…Assuming that the incident beam enters the crystal at an incident angle of O", the penetration depth of the 2.0 and the 5. 4 MeV beam would be 5.4 and 20.4 pm, respectively. Fig.…”
Section: I-u and C-u Measurementsmentioning
confidence: 99%
“…Hopkins and Srour [3] reported for the first time on the measurement of a-particle induced charge in Schottky diodes fabricated on n-type GaAs. Umemoto et al [4] reported the influence of a-particle induced damage on the performance of metal-semiconductor field-effect transistors (MESFETs) fabricated on semiinsulating GaAs, whereas Zardas et al [5] investigated the dependence of the current-voltage (I-U) characteristics of GaAs MESFETs on temperature and a-particle irradiation. It has been well known for decades that, in principle, it is possible to dope gallium arsenide with impurities resulting from nuclear reactions based on thermal neutrons, y-rays, and charged particles.…”
Section: Introductionmentioning
confidence: 99%
“…Hopkins and Srour [3] reported for the first time on the measurement of alpha-particle-induced charge in Schottky diodes fabricated on n-type GaAs. Umemoto et al [4] reported on the influence of alpha-particleinduced damage on the performance of Metal Semiconductor Field-Effect Transistors (MESFETs). It has been well known that, in principle, it is possible to dope GaAs with impurities resulting from nuclear reactions based on thermal neutrons, gamma-rays and charged particles.…”
mentioning
confidence: 99%
“…Device technology techniques, such as buffer layers, or p-implants, can be used to reduce the effects of funneling, and decrease collection volume dimensions [130,131]. Circuit hardening techniques use additional circuit elements to isolate hit nodes from information storage nodes.…”
Section: Hardening Techniquesmentioning
confidence: 99%