Effectiveness of tungsten addition on the performance of electroplated nickel diffusion barriers for copper metallization on textured silicon

Chen, W.J.; Lai, Ting-Yu

doi:10.1016/j.tsf.2022.139122

Cited by 2 publications

(2 citation statements)

References 17 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Besides observing a sharpening of the peaks in those samples with heat treatment, two smaller peaks around 45° are observed in the high-temperature MF sample. According to the literature, these peaks correspond to the Cu 3 Si intermetallic phase, which is formed due to the interdiffusion of these elements at high temperatures [ 48 , 49 , 50 ]. This observation is in good agreement with the FESEM images of this sample in Figure 6 , where an interaction between copper and silicon can be seen in the cross-section image.…”

Section: Resultsmentioning

confidence: 99%

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Bikarregi,

Dominguez,

Brizuela

et al. 2023

Sensors

View full text Add to dashboard Cite

Reducing the economic and environmental impact of industrial process may be achieved by the smartisation of different components. In this work, tube smartisation is presented via direct fabrication of a copper (Cu)-based resistive temperature detector (RTD) on their outer surfaces. The testing was carried out between room temperature and 250 °C. For this purpose, copper depositions were studied using mid-frequency (MF) and high-power impulse magnetron sputtering (HiPIMS). Stainless steel tubes with an outside inert ceramic coating were used after giving them a shot blasting treatment. The Cu deposition was performed at around 425 °C to improve adhesion as well as the electrical properties of the sensor. To generate the pattern of the Cu RTD, a photolithography process was carried out. The RTD was then protected from external degradation by a silicon oxide film deposited over it by means of two different techniques: sol–gel dipping technique and reactive magnetron sputtering. For the electrical characterisation of the sensor, an ad hoc test bench was used, based on the internal heating and the external temperature measurement with a thermographic camera. The results confirm the linearity (R2 > 0.999) and repeatability in the electrical properties of the copper RTD (confidence interval < 0.0005).

show abstract

Section: Resultsmentioning

confidence: 99%

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Bikarregi,

Dominguez,

Brizuela

et al. 2023

Sensors

View full text Add to dashboard Cite

show abstract

“…Electroplating is a well-known, low-cost, and easy-to-carry-out coating deposition process which has been in use for many decades. The coatings produced are mainly metallic anticorrosive coatings, but also diffusion barriers [21][22][23]. Due to the many possibilities and advantages of this method, the coatings produced in this way are still the subject of scientific research [24,25].…”

Section: Introductionmentioning

confidence: 99%

Behaviour of nickel coatings made by brush plating technology in conditions of cavitation erosion and corrosion

Krella

Grześ

Erbe

et al. 2023

Wear

View full text Add to dashboard Cite

Effectiveness of tungsten addition on the performance of electroplated nickel diffusion barriers for copper metallization on textured silicon

Cited by 2 publications

References 17 publications

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Behaviour of nickel coatings made by brush plating technology in conditions of cavitation erosion and corrosion

Contact Info

Product

Resources

About