2016
DOI: 10.1021/acsami.6b02496
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Effectively Exerting the Reinforcement of Dopamine Reduced Graphene Oxide on Epoxy-Based Composites via Strengthened Interfacial Bonding

Abstract: The effects of dopamine reduced graphene oxide (pDop-rGO) on the curing activity and mechanical properties of epoxy-based composites were evaluated. Taking advantage of self-polymerization of mussel-inspired dopamine, pDop-rGO was prepared through simultaneous functionalization and reduction of graphene oxide (GO) via polydopamine coating. Benefiting from the universal binding ability of polydopamine, good dispersion of pDop-rGO in epoxy matrix was able to be achieved as the content of pDop-rGO being below 0.2… Show more

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Cited by 135 publications
(96 citation statements)
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“…As expected, both the onset T onset and peak T P temperatures were different at all heating rates for the two systems. Compared to the BN with graphene filled epoxy adhesive, epoxy/graphene adhesive showed higher value of ( T P ) indicating that graphene might restrain during the curing reaction of the matrix . Further, higher value of T onset and T P with the addition of BN content indicates that BN act as a catalyst and facilitates the curing reaction.…”
Section: Resultssupporting
confidence: 94%
“…As expected, both the onset T onset and peak T P temperatures were different at all heating rates for the two systems. Compared to the BN with graphene filled epoxy adhesive, epoxy/graphene adhesive showed higher value of ( T P ) indicating that graphene might restrain during the curing reaction of the matrix . Further, higher value of T onset and T P with the addition of BN content indicates that BN act as a catalyst and facilitates the curing reaction.…”
Section: Resultssupporting
confidence: 94%
“…The hindered and accelerated cure, respectively, caused by GO and amine‐modified GO, were reported for systems containing very low amount of GO (0.1 wt % GO) . The results confirmed that even at such low concentration of GO there was possibility for aggregation of platelets, while proper functionalization of GO efficiently prevented aggregation leading to an accelerated curing process.…”
Section: Introductionsupporting
confidence: 53%
“…PLGA exhibited an exothermal peak temperature ( T m , associated with the melting process) at 358 °C (Figure C). Due to the restraint effect on the curing reaction of PLGA by the PDA coating, the T m of PLGA‐PDA and PLGA‐PDA‐GO increased to 362 and 360 °C, respectively. In this analysis, the T m of PLGA‐PDA‐GO was slightly lower than that of PLGA‐PDA, implying that the immobilized GO weakened the restraint effect.…”
Section: Resultsmentioning
confidence: 99%