2017 IEEE 67th Electronic Components and Technology Conference (ECTC) 2017
DOI: 10.1109/ectc.2017.242
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Effective Evaluation Method: A New Delamination Test Method for MUF (Molded Underfill) Package

Junghwa Kim
1
,
Seung Hun Han
2
,
Woochul Na3
et al.
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