Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

Islam, M. N.; Sharif, Ahmed; Chan, Y.C.

doi:10.1007/s11664-005-0225-z

Cited by 92 publications

(47 citation statements)

References 12 publications

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“…[1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17] In some of these studies, growth of IMCs during reflow was measured. 1,2,4,7,8,[10][11][12][13]15 In others, substrate dissolution rates were measured.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Dariavach¹,

Callahan²,

Liang³

et al. 2006

Journal of Elec Materi

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Soldering with the lead-free tin-base alloys requires substantially higher temperatures (;235-250°C) than those (213-223°C) required for the current tin-lead solders, and the rates for intermetallic compound (IMC) growth and substrate dissolution are known to be significantly greater for these alloys. In this study, the IMC growth kinetics for Sn-3.7Ag, Sn-0.7Cu, and Sn-3.8Ag-0.7Cu solders on Cu substrates and for Sn-3.8Ag-0.7Cu solder with three different substrates (Cu, Ni, and Fe-42Ni) are investigated. For all three solders on Cu, a thick scalloped layer of h phase (Cu 6 Sn 5 ) and a thin layer of e phase (Cu 3 Sn) were observed to form, with the growth of the layers being fastest for the Sn-3.8Ag-0.7Cu alloy and slowest for the Sn-3.7Ag alloy. For the Sn-3.8Ag-0.7Cu solder on Ni, only a relatively uniform thick layer of h phase (Cu,Ni) 6 Sn 5 growing faster than that on the Cu substrate was found to form. IMC growth in both cases appears to be controlled by grain-boundary diffusion through the IMC layer. For the Fe-42Ni substrate with the Sn-3.8Ag-0.7Cu, only a very thin layer of (Fe,Ni)Sn 2 was observed to develop.

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Section: Introductionmentioning

confidence: 99%

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Dariavach¹,

Callahan²,

Liang³

et al. 2006

Journal of Elec Materi

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“…When the percentage of Cu at any site reaches the threshold limit for Cu 6 Sn 5 compound formation (i.e., around 39wt.%Cu according to the Cu-Sn phase diagram), Cu-Sn IMC precipitates in the bulk solder. 19 In the case of the In-containing solder, the thickness of QIMCs was 6.93 µm. The growth rate of QIMCs was lower than that for medium-Cu containing TIMCs (Figs.…”

Section: Interfaces After Long-time Molten Reactionsmentioning

confidence: 99%

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Islam

Chan

2005

Journal of Elec Materi

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Cu-containing solder alloys have been used to identify their interfacial reactions with electroless NiP. As-reflowed, AuSn 4 intermetallic compounds (IMCs) are formed in the Sn-Cu and Sn-Ag-Cu solders, but in the cases of Sn-Ag-Cu-In, In-Sn-Au IMCs are formed and are uniformly distributed in the solder. Different types of IMCs such as high-Cu (Ͼ30 at.%), medium-Cu (30-15 at.%), and low-Cu (Ͻ15 at.%) containing IMCs are formed at the interface. High-Cu and medium-Cu containing ternary intermetallic compounds (TIMCs) are found in the Sn-Cu and Sn-Ag-Cu solder joints, respectively. Medium-Cu containing quaternary intermetallic compounds (QIMCs) are found in the Sn-Ag-Cu-In joints. Initially, TIMCs and QIMCs have higher growth rates, resulting in the entrapment of some Pb-rich phase in the high-Cu containing TIMCs and some In-Sn-Au phase in the QIMCs. High-Cu containing TIMCs have a lower growth rate and consume less of the NiP layer. The spalling of medium-Cu containing TIMCs in the Sn-Ag-Cu solder increases both the growth rate of TIMCs and the consumption rate of the NiP layer. Low-Cu containing QIMCs in the Sn-Ag-CuIn solder are stable on P-rich Ni and reduce the dissolution rate of the NiP layer. Consumption of the NiP layer can be reduced by adding Cu or In, because of the changes of the interfacial IMCs phases, which are stable and adhere well to the P-rich Ni layer during reflow.

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“…The Sn-3.5Ag-0.5Cu composition, which is often used in current industrial processes, has a melting point of 217 ℃. In order to ensure sufficient wettability, reaction characteristics, and reliable yield, it is necessary to apply a temperature profile of 250 ℃ or more when examining such solders [10,11].…”

Section: Introductionmentioning

confidence: 99%

Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes

Hwang¹,

Jeong²,

Lee³

2018

Korean J. Met. Mater.

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We used Sn-58Bi and Cu wires to investigate the effects of variable conditions (such as pressure and wire diameter) on the formation of three-component nanoparticles. In the synthesis of the three-component nanoparticles, pulsed wire discharge was used to sublimate the wires. In this system, the K factor is described as Ec/Es, where Ec and Es are respectively the applied energy and the sublimation energy of the system. Experiments were conducted in a N2 atmosphere using the following parameters: voltage of 6 kV, pressure of 50-100 kPa, and Cu wire diameters of 0.1 and 0.2 mm. X-ray diffraction and field emission scanning electron microscopy were employed for structural analysis, particle size distribution analysis, collection rate, and composition studies of the nanoparticles.†

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Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

Cited by 92 publications

References 12 publications

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Intermetallic growth kinetics for Sn-Ag, Sn-Cu, and Sn-Ag-Cu lead-free solders on Cu, Ni, and Fe-42Ni substrates

Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

Liquid-Phase Reaction Sintering Behavior at below 200 °C and Electrical Sheet Resistance of Sn-58Bi/Cu Composite Pastes

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