Effect of tool edge radius on material removal mechanism in atomic and close-to-atomic scale cutting

Xie, Wenkun; Fang, Fengzhou

doi:10.1016/j.apsusc.2019.144451

Cited by 32 publications

(13 citation statements)

References 29 publications

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“…This phenomenon has been visualised in Figure 2. A previous study showed that the tangential force is affected by the material pile-up in the direction of the x-axis, which coincides with the cutting direction [20]. As expected, it can be seen that in the Figure 3a, there is a large difference between the average values of the two cutting forces.…”

Section: Cutting Forcessupporting

confidence: 77%

“…They showed that the cutting process is affected by the interaction between the tool and workpiece atoms. One of the most investigated topics related to nanocutting phenomena is the effect of the tool geometry on the grinding mechanics [20]. Xie and Fang [21] conducted an investigation, which was mainly focused on the effects of the cutting-edge radius on the chip formation, cutting forces, and stress distribution at atomic and close-to-atomic scales (ACS).…”

Section: Introductionmentioning

confidence: 99%

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Investigation of the Subsurface Temperature Effects on Nanocutting Processes via Molecular Dynamics Simulations

Papanikolaou

Hernández

Salonitis

2020

Metals

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In this investigation, three-dimensional molecular dynamics simulations have been performed in order to investigate the effects of the workpiece subsurface temperature on various nanocutting process parameters including cutting forces, friction coefficient, as well as the distribution of temperature and equivalent Von Mises stress at the subsurface. The simulation domain consists of a tool with a negative rake angle made of diamond and a workpiece made of copper. The grinding speed was considered equal to 100 m/s, while the depth of cut was set to 2 nm. The obtained results suggest that the subsurface temperature significantly affects all of the aforementioned nanocutting process parameters. More specifically, it has been numerically validated that, for high subsurface temperature values, thermal softening becomes dominant and this results in the reduction of the cutting forces. Finally, the dependency of local properties of the workpiece material, such as thermal conductivity and residual stresses on the subsurface temperature has been captured using numerical simulations for the first time to the authors’ best knowledge.

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Section: Cutting Forcessupporting

confidence: 77%

Section: Introductionmentioning

confidence: 99%

Investigation of the Subsurface Temperature Effects on Nanocutting Processes via Molecular Dynamics Simulations

Papanikolaou

Hernández

Salonitis

2020

Metals

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“…The next generation of manufacturing is known as Manufacturing III, which is at the atomic scale [164,165]. Currently, molecular dynamics simulations are best suited for studying the possibilities of material removal mechanisms [166][167][168][169][170]. These simulations help to visually analyze the interactions occurring at the atomic scale.…”

Section: Research Trends and Future Outlookmentioning

confidence: 99%

Atomic and Close-to-Atomic Scale Manufacturing: A Review on Atomic Layer Removal Methods Using Atomic Force Microscopy

Mathew

Rodriguez

2020

Nanomanuf Metrol

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Manufacturing at the atomic scale is the next generation of the industrial revolution. Atomic and close-to-atomic scale manufacturing (ACSM) helps to achieve this. Atomic force microscopy (AFM) is a promising method for this purpose since an instrument to machine at this small scale has not yet been developed. As the need for increasing the number of electronic components inside an integrated circuit chip is emerging in the present-day scenario, methods should be adopted to reduce the size of connections inside the chip. This can be achieved using molecules. However, connecting molecules with the electrodes and then to the external world is challenging. Foundations must be laid to make this possible for the future. Atomic layer removal, down to one atom, can be employed for this purpose. Presently, theoretical works are being performed extensively to study the interactions happening at the molecule–electrode junction, and how electronic transport is affected by the functionality and robustness of the system. These theoretical studies can be verified experimentally only if nano electrodes are fabricated. Silicon is widely used in the semiconductor industry to fabricate electronic components. Likewise, carbon-based materials such as highly oriented pyrolytic graphite, gold, and silicon carbide find applications in the electronic device manufacturing sector. Hence, ACSM of these materials should be developed intensively. This paper presents a review on the state-of-the-art research performed on material removal at the atomic scale by electrochemical and mechanical methods of the mentioned materials using AFM and provides a roadmap to achieve effective mass production of these devices.

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“…21,22 Therefore, simulation has become an important tool to study the mechanism of micromachining. Molecular dynamics (MD) simulation is widely used in nano-cutting, 23–26 nano-milling, 27 nano-grinding 28,29 and other nanomachining fields. It has been proved to be a powerful tool to study the mechanism of material removal at nanometer scale.…”

Section: Introductionmentioning

confidence: 99%

Study on phase transformation in cutting Ni-base superalloy based on molecular dynamics method

Hao

Lou

Fan

2020

Proceedings of the Institution of Mechanical Engineers, Part C:

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Nickel-based single crystal alloys are widely used in aerospace and other important fields of national defense due to their excellent properties. Phase transformation occurs during high-speed cutting of nickel-based single crystal alloy, which seriously affects the surface quality. It is of great significance to carry out theoretical research on phase transformation for improving the machining quality of nickel-based alloy. In this paper, molecular dynamics method is used to study the nano-cutting of single crystal nickel-based alloy with silicon nitride ceramic tool. The mechanism of phase transformation and the effect of cutting speed on phase transformation in workpieces are studied in detail. The nano-cutting model is established. Morse potential functions for molecular dynamics simulation are calculated, and EAM and Tersoff potential functions are selected. The effect of cutting speed on phase transformation was studied by using radial distribution function, coordination number analysis, common neighbor analysis, and the deep reasons for the sharp change of lattice structure were analyzed from many aspects. Finally, in order to verify the universality of the research results and explore the new properties of compression, nano compression (the same strain rate as the nano cutting process) was simulated. The results show that the increase of cutting speed leads to the increase of hydrostatic stress, the increase of energy in crystal and the rise of cutting temperature. As a result, the change of lattice structure becomes more and more intense, and the conversion rate of different crystal structures increases greatly.

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Effect of tool edge radius on material removal mechanism in atomic and close-to-atomic scale cutting

Cited by 32 publications

References 29 publications

Investigation of the Subsurface Temperature Effects on Nanocutting Processes via Molecular Dynamics Simulations

Investigation of the Subsurface Temperature Effects on Nanocutting Processes via Molecular Dynamics Simulations

Atomic and Close-to-Atomic Scale Manufacturing: A Review on Atomic Layer Removal Methods Using Atomic Force Microscopy

Study on phase transformation in cutting Ni-base superalloy based on molecular dynamics method

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