Atomic and Close-to-Atomic Scale Manufacturing: A Review on Atomic Layer Removal Methods Using Atomic Force Microscopy

Abstract

Manufacturing at the atomic scale is the next generation of the industrial revolution. Atomic and close-to-atomic scale manufacturing (ACSM) helps to achieve this. Atomic force microscopy (AFM) is a promising method for this purpose since an instrument to machine at this small scale has not yet been developed. As the need for increasing the number of electronic components inside an integrated circuit chip is emerging in the present-day scenario, methods should be adopted to reduce the size of connections inside the chip. This can be achieved using molecules. However, connecting molecules with the electrodes and then to the external world is challenging. Foundations must be laid to make this possible for the future. Atomic layer removal, down to one atom, can be employed for this purpose. Presently, theoretical works are being performed extensively to study the interactions happening at the molecule–electrode junction, and how electronic transport is affected by the functionality and robustness of the system. These theoretical studies can be verified experimentally only if nano electrodes are fabricated. Silicon is widely used in the semiconductor industry to fabricate electronic components. Likewise, carbon-based materials such as highly oriented pyrolytic graphite, gold, and silicon carbide find applications in the electronic device manufacturing sector. Hence, ACSM of these materials should be developed intensively. This paper presents a review on the state-of-the-art research performed on material removal at the atomic scale by electrochemical and mechanical methods of the mentioned materials using AFM and provides a roadmap to achieve effective mass production of these devices.

State of the Art in Defect Detection Based on Machine Vision

“…During a micro-manufacturing process, the occurrence of surface imperfections is a critical problem [78]. Nevertheless, some conventional detection platforms are often unable to detect micro-defects on micro-parts [79]. In this regard, some researchers have put forth, micro-domain vision detection technologies to acquire and analyze 2D textures and 3D shape information, which effectively solved this problem.…”

“…Manufacturing III takes atomic and close-to-scale manufacturing (ACSM) as the core technology and has become the primary future development trend in manufacturing [79,272,284]. To develop ACSM, defect detection will be a very important area.…”

Orientation effect of electropolishing characteristics of 316L stainless steel fabricated by laser powder bed fusion

“…Electropolishing is an efficient polishing process for metal materials in concentrated electrolytes; it generates a damage-free surface because the material is removed through anodic dissolution [1][2][3]. Atomic and close-toatomic scale accuracy is possible with the electrochemical machining and electropolishing method because the material is removed atom by atom in the anodic dissolution [4][5][6]. Electropolishing of the surfaces fabricated by laser powder bed fusion (L-PBF) has been reported as an effective method to improve the surface roughness [7][8][9] and remove the outmost layer with residual stress without causing thermal and mechanical stress [10,11].…”

Surface and Subsurface Quality Assessment of Polished Lu2O3 Single Crystal Using Quasi-Brewster Angle Technique

“…Since subsurface damage is overlapped by the sample surface, high precision assessment of subsurface damage is challenging. In addition, as ultra-precision machining moves toward atomic and close-to-atomic scale manufacturing (ACSM), subsurface damage scales approach the nano/sub-nano level and are coupled, further increasing the difficulty of detection [14]. Subsurface damage detection methods are categorized into destructive and non-destructive methods according to its destructiveness to the sample.…”