Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Azina, Clio; Cornu, Iñaki; Silvain, Jean François; Lu, Yongfeng; Battaglia, Jean-Luc

doi:10.1063/1.5052307

Cited by 16 publications

(5 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Furthermore, comparing the micro-Raman spectra of the as-received diamond particles and the coated diamond after laser printing revealed no graphitization in the diamond structure (refer to Figure 99). They also reported an excellent thermal conductivity of 330 W/m.k, which is relatively higher than the values reported for the Cu/diamond composites fabricated using field-assisted sintering technology (302 W/m.k) [192] and mixing + sintering + hot-pressing (276 W/m•k) [193]. Although Constantin et al [175] conducted extensive microstructural characterizations, they did not measure the mechanical properties in their study, which should be investigated in future research.…”

Section: Am Of Cu-c Compositesmentioning

confidence: 75%

Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Vahedi Nemani,

Ghaffari,

Sabet Bokati

et al. 2024

JMMP

View full text Add to dashboard Cite

Copper-based materials have long been used for their outstanding thermal and electrical conductivities in various applications, such as heat exchangers, induction heat coils, cooling channels, radiators, and electronic connectors. The development of advanced copper alloys has broadened their utilization to include structural applications in harsh service conditions found in industries like oil and gas, marine, power plants, and water treatment, where good corrosion resistance and a combination of high strength, wear, and fatigue tolerance are critical. These advanced multi-component structures often have complex designs and intricate geometries, requiring extensive metallurgical processing routes and the joining of the individual components into a final structure. Additive manufacturing (AM) has revolutionized the way complex structures are designed and manufactured. It has reduced the processing steps, assemblies, and tooling while also eliminating the need for joining processes. However, the high thermal conductivity of copper and its high reflectivity to near-infrared radiation present challenges in the production of copper alloys using fusion-based AM processes, especially with Yb-fiber laser-based techniques. To overcome these difficulties, various solutions have been proposed, such as the use of high-power, low-wavelength laser sources, preheating the build chamber, employing low thermal conductivity building platforms, and adding alloying elements or composite particles to the feedstock material. This article systematically reviews different aspects of AM processing of common industrial copper alloys and composites, including copper-chrome, copper-nickel, tin-bronze, nickel-aluminum bronze, copper-carbon composites, copper-ceramic composites, and copper-metal composites. It focuses on the state-of-the-art AM techniques employed for processing different copper-based materials and the associated technological and metallurgical challenges, optimized processing variables, the impact of post-printing heat treatments, the resulting microstructural features, physical properties, mechanical performance, and corrosion response of the AM-fabricated parts. Where applicable, a comprehensive comparison of the results with those of their conventionally fabricated counterparts is provided.

show abstract

Section: Am Of Cu-c Compositesmentioning

confidence: 75%

Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Vahedi Nemani,

Ghaffari,

Sabet Bokati

et al. 2024

JMMP

View full text Add to dashboard Cite

show abstract

“…Where k is the thermal conductivity (W/m.K), a is the thermal diffusivity (mm 2 /s), ρ is the density, and Cp is the heat capacity of the sample (J/Kg.K). The effective Cp is calculated from that of D, TiC, and Cu that were 630, 190, and 392 J/Kg.K, respectively [31]. More information on the measurement can be found in supplementary information.…”

Section: Characterization Of Cu/d Compositesmentioning

confidence: 99%

“…Copper and D are known as a nonreactive system with a lack of chemical affinity [32,33]. Several studies have indicated that the Cu-D interfacial resistance is the main parameter that governs the resulting TC [31]. Therefore, creating interphase between both components can allow a proper thermal transfer from the matrix to the reinforcement [4,34,35].…”

Section: Conventional Laser Powder Bed Fusion Of Cu/d Compositesmentioning

confidence: 99%

Manufacturing of complex diamond-based composite structures via laser powder-bed fusion

Constantin

Kraiem

et al. 2021

Additive Manufacturing

Self Cite

View full text Add to dashboard Cite

“…32, and this facilitates more phonon transmission. This method has been experimentally applied and demonstrated in copper/diamond composites [80,114].…”

Section: Thermal Conductance Of the Interface Layermentioning

confidence: 99%

High thermal conductive copper/diamond composites: state of the art

Jia

Yang

2020

J Mater Sci

View full text Add to dashboard Cite

Copper/diamond composites have drawn lots of attention in the last few decades, due to its potential high thermal conductivity and promising applications in high-power electronic devices. However, the bottlenecks for their practical application are high manufacturing/machining cost and uncontrollable thermal performance affected by the interface characteristics, and the interface thermal conductance mechanisms are still unclear. In this paper, we reviewed the recent research works carried out on this topic, and this primarily includes (1) evaluating the commonly acknowledged principles for acquiring high thermal conductivity of copper/diamond composites that are produced by different processing methods; (2) addressing the factors that influence the thermal conductivity of copper/diamond composites; and (3) elaborating the interface thermal conductance problem to increase the understanding of thermal transferring mechanisms in the boundary area and provide necessary guidance for future designing the composite interface structure. The links between the composite’s interface thermal conductance and thermal conductivity, which are built quantitatively via the developed models, were also reviewed in the last part.

show abstract

Effect of titanium and zirconium carbide interphases on the thermal conductivity and interfacial heat transfers in copper/diamond composite materials

Cited by 16 publications

References 32 publications

Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Advancements in Additive Manufacturing for Copper-Based Alloys and Composites: A Comprehensive Review

Manufacturing of complex diamond-based composite structures via laser powder-bed fusion

High thermal conductive copper/diamond composites: state of the art

Contact Info

Product

Resources

About