Effect of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper

Liu, W.L.; Chen, W.J.; Tsai, Tsung-Che; Hsieh, Shu‐Kai; Liu, C.M.

doi:10.1016/j.tsf.2006.04.042

Cited by 10 publications

(5 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Besides observing a sharpening of the peaks in those samples with heat treatment, two smaller peaks around 45° are observed in the high-temperature MF sample. According to the literature, these peaks correspond to the Cu 3 Si intermetallic phase, which is formed due to the interdiffusion of these elements at high temperatures [ 48 , 49 , 50 ]. This observation is in good agreement with the FESEM images of this sample in Figure 6 , where an interaction between copper and silicon can be seen in the cross-section image.…”

Section: Resultsmentioning

confidence: 99%

“…Likewise, the temperature range in which this barrier is stable will be conditioned by the materials used to create it. Results were reported with the use of alloys with copper and other metals such as aluminium, calcium, or tantalum [ 58 , 59 , 60 , 61 , 62 , 63 ], or with various types of oxides, carbides, or nitrides [ 49 , 64 ]. To work at very high temperatures, high-entropy alloys were also been deposited at the interface of copper with silicon [ 65 ].…”

Section: Resultsmentioning

confidence: 99%

See 1 more Smart Citation

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Bikarregi,

Dominguez,

Brizuela

et al. 2023

Sensors

View full text Add to dashboard Cite

Reducing the economic and environmental impact of industrial process may be achieved by the smartisation of different components. In this work, tube smartisation is presented via direct fabrication of a copper (Cu)-based resistive temperature detector (RTD) on their outer surfaces. The testing was carried out between room temperature and 250 °C. For this purpose, copper depositions were studied using mid-frequency (MF) and high-power impulse magnetron sputtering (HiPIMS). Stainless steel tubes with an outside inert ceramic coating were used after giving them a shot blasting treatment. The Cu deposition was performed at around 425 °C to improve adhesion as well as the electrical properties of the sensor. To generate the pattern of the Cu RTD, a photolithography process was carried out. The RTD was then protected from external degradation by a silicon oxide film deposited over it by means of two different techniques: sol–gel dipping technique and reactive magnetron sputtering. For the electrical characterisation of the sensor, an ad hoc test bench was used, based on the internal heating and the external temperature measurement with a thermographic camera. The results confirm the linearity (R2 > 0.999) and repeatability in the electrical properties of the copper RTD (confidence interval < 0.0005).

show abstract

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Bikarregi,

Dominguez,

Brizuela

et al. 2023

Sensors

View full text Add to dashboard Cite

show abstract

“…Other cost‐effective, but more reflective metals such as Cu are frequently used together with an ITO diffusion barrier in crystalline‐Si solar cells and could possibly enhance the maximum attainable photocurrents to the level of a B II stack with a Au bottom electrode. [ 20–22 ]…”

Section: Resultsmentioning

confidence: 99%

Perovskite Solar Cells on Polymer‐Coated Smooth and Rough Steel Substrates

et al. 2022

View full text Add to dashboard Cite

Building integration of perovskite solar cells could 1 day become feasible because of their low cost, aesthetics, lightweight, and impressive power conversion efficiency (PCE). [1][2][3][4][5] When focusing on potential substrate materials compatible with the building industry, coated steel offers an interesting perspective because it is one of the most common architectural materials, especially in industrial buildings. Steel is a cheap (substrate) material and offers excellent mechanical, heat resistance, and barrier properties against oxygen and humidity. [6,7] Combining perovskite solar cells with steel can give added value to this commonly employed building material. One of the challenges to tackle when fabricating solar cells directly on steel substrates is the higher surface roughness as compared to glass or polymer film which can be fatal for thin-film solar cells. Using smooth steel substrates would add to the cost due to the extra surface polishing steps. The cost can be reduced when combining rough steel substrates with an additional planarization layer. [8] Fabricating perovskite solar cells on rough substrates may reduce device performance and yield, due to irregularities such as spike-like protrusions, valleys, and peaks. To investigate the impact of surface roughness on the photovoltaic performance, we developed a substrate-configuration n-i-p solar cell for coated steel substrates (Figure 1). Fabrication of perovskite solar cells on rough substrates has been mostly studied in superstrateconfiguration single-junction and top-illuminated perovskite Si monolithic tandem solar cells. [9][10][11][12][13][14][15] In several studies on tandem solar cell applications a rough pyramidal-textured Si substrate has been used. To achieve a conformal coverage of the perovskite active layer, the perovskite layer needs to be sufficiently thick, or it needs to be deposited via co-evaporation [9][10][11] or a hybrid evaporation/spin coating deposition method. [12][13][14] Tockhorn et al. demonstrated conformal coating of the perovskite active layer in single-junction superstrate-configuration perovskite solar cells by employing a self-assembled [2-(9H-carbazol-9-yl)ethyl]phosphonic acid (2PACz) monolayer hole transport layer (HTL) on a nanotextured indium tin oxide (ITO) glass substrate providing 19.7% efficiency. [15] In substrate-configuration perovskite solar cells, most devices have been fabricated on polished Ti foils, reaching efficiencies up to 15%. [16] Although most studies on substrate-configuration perovskite solar cells use polished Ti

show abstract

“…The heterojunction structure offers a significant advantage when it comes to copper plating. This advantage arises from the absence of a direct contact between the metal and the silicon, and the presence of transparent conductive oxide (TCO), which is an excellent barrier against copper diffusion [2,3].…”

Section: Introductionmentioning

confidence: 99%

Aging tests of mini-modules with copper-plated heterojunction solar cells and pattern-transfer-printing of copper paste

Lachowicz,

Badel,

Barrou

et al. 2024

EPJ Photovolt.

View full text Add to dashboard Cite

Mini-module aging tests with differently interconnected heterojunction solar cells having industrially viable copper metallization are presented. The plating process comprises 3 steps: firstly, screen printing of a seed-grid layout using a copper-based paste, followed by deposition of a dielectric layer over the entire wafer surface, and finally, selective copper electrodeposition on grid positions. Modules with Smartwire interconnection, fabricated with M6 half-cells, are stable in extended TC and PID tests. DH degradation is at 5% after 2700 h (glass-glass modules without edge sealing). Shingle modules, realized in collaboration with CEA INES and AMAT, exhibit notably higher fill factor compared to reference modules with screen-printed silver paste. This improvement is attributed to the superior line conductivity achieved with plated copper. TC stability of shingle modules is very good, whereas after 2000 h damp-heat aging more than 2% loss in fill factor is observed. Using pattern-transfer-printing technology narrow, high aspect-ratio lines have been obtained: with a seed-grid of pure copper paste, reinforced with electrodeposited copper. Line dimensions and line resistance as well as first cell results are presented.

show abstract

Effect of tin-doped indium oxide film thickness on the diffusion barrier between silicon and copper

Cited by 10 publications

References 25 publications

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques

Perovskite Solar Cells on Polymer‐Coated Smooth and Rough Steel Substrates

Aging tests of mini-modules with copper-plated heterojunction solar cells and pattern-transfer-printing of copper paste

Contact Info

Product

Resources

About