2003
DOI: 10.1143/jjap.42.5687
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Effect of Thermal Treatment of Undoped Bi4Ti3O12Thin Films Prepared by Metalorganic Chemical Vapor Deposition

Abstract: We study a phenomenological ansatz for merging next-to-next-to-leading order (NNLO) calculations with Monte Carlo event generators. We reweight them to match binintegrated NNLO differential distributions. To test this procedure, we study the Higgs boson production cross-section at the LHC, for which a fully differential partonic NNLO calculation is available. We normalize PYTHIA and MC@NLO Monte Carlo events for Higgs production in the gluon fusion channel to reproduce the bin integrated NNLO double differenti… Show more

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Cited by 7 publications
(6 citation statements)
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“…The pressure in the reaction chamber was fixed at approximately 5 Torr. 12,13) The substrate temperature (T sub ) was varied in the range of 350 C and 500 C. The total thickness of the BIT thin film and buffer layer was fixed at 400 nm. Finally, the top Pt electrodes with a diameter of 0.2 mm were deposited on the film surface through a metal shadow mask by rf-magnetron sputtering in order to measure the electrical properties.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…The pressure in the reaction chamber was fixed at approximately 5 Torr. 12,13) The substrate temperature (T sub ) was varied in the range of 350 C and 500 C. The total thickness of the BIT thin film and buffer layer was fixed at 400 nm. Finally, the top Pt electrodes with a diameter of 0.2 mm were deposited on the film surface through a metal shadow mask by rf-magnetron sputtering in order to measure the electrical properties.…”
Section: Methodsmentioning
confidence: 99%
“…However, it is difficult to prepare a perfect aaxis-oriented BIT thin film, since interdiffusion occurs between the electrode and poly-Si plug during ferroelectric film formation at high crystallization temperatures. [5][6][7][8][9][10][11][12][13][14][15] The formation process at low temperatures below 500 C is desirable for the realization of poly-Si-plug stacked capacitor memory cells.…”
Section: Introductionmentioning
confidence: 99%
“…Bismuth layer-structured ferroelectrics Bi 4 Ti 3 0 12 (BIT) thin film is expected for application to nonvolatile ferroelectric random access memory (NV -Fe RAM) devices with nondestructive readout operation due to its excellent fatigue endurance when in the deposition of this film with Pt electrode [1][2][3]. In recent years, preparation of BIT thin film has been investigated by several deposition techniques such as sol-gel [ 4,5] , metalorganic decomposition (MOD) [6,7], metalorganic chemical vapor deposition (MOCVD) [8][9][10][11][12][13][14] , and RF magnetron sputtering [I 5-2 I]. From the point of view of commercial production using sol-gel, MOD, and MOCVD methods, there are still some severe difficulties, for instance poor throughput (low deposition rate), high-temperature deposition, compositional nonuniformity across large substrate, rough surface morphology, lack of appropriate precursors in the gas phase, and poor reproducibility.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, Nakamura et al and eo-workers have prepared the BIT thin films with a Ti0 2 anatase layer on the Pt/Ti/Si0 2 /Si substrates by metalorganic chem ical vapor deposition (MOCVD) [13][14][15][16] . The BIT thin film with the Ti0 2 anatase layer exhibited highly a-and b-axes-oriented BIT single phases, although the BIT thin film with no-layer exhibited a c-axis orientation.…”
Section: Introductionmentioning
confidence: 99%