“…Bismuth layer-structured ferroelectrics Bi 4 Ti 3 0 12 (BIT) thin film is expected for application to nonvolatile ferroelectric random access memory (NV -Fe RAM) devices with nondestructive readout operation due to its excellent fatigue endurance when in the deposition of this film with Pt electrode [1][2][3]. In recent years, preparation of BIT thin film has been investigated by several deposition techniques such as sol-gel [ 4,5] , metalorganic decomposition (MOD) [6,7], metalorganic chemical vapor deposition (MOCVD) [8][9][10][11][12][13][14] , and RF magnetron sputtering [I 5-2 I]. From the point of view of commercial production using sol-gel, MOD, and MOCVD methods, there are still some severe difficulties, for instance poor throughput (low deposition rate), high-temperature deposition, compositional nonuniformity across large substrate, rough surface morphology, lack of appropriate precursors in the gas phase, and poor reproducibility.…”