2020
DOI: 10.1016/j.tafmec.2020.102583
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Effect of the stress field on crack branching in brittle material

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Cited by 10 publications
(4 citation statements)
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“…In this process, stress concentration occurs in both PCD layer II and the bonding layer between alloy matrix and polycrystalline diamond due to differences in physical properties resulting from high temperature and high pressure synthesis of base alloy materials and polycrystalline diamond properties. These residual stresses lead to extrusion cracks in PCD layer II and the bonding layer [36], as shown clearly in Figure 12b when magnifying crack sources observed in Figure 12a. "dragon-claw" on the left and right, as shown in Figure 12a.…”
Section: Crack Expansion Of the Pdc Layermentioning
confidence: 91%
“…In this process, stress concentration occurs in both PCD layer II and the bonding layer between alloy matrix and polycrystalline diamond due to differences in physical properties resulting from high temperature and high pressure synthesis of base alloy materials and polycrystalline diamond properties. These residual stresses lead to extrusion cracks in PCD layer II and the bonding layer [36], as shown clearly in Figure 12b when magnifying crack sources observed in Figure 12a. "dragon-claw" on the left and right, as shown in Figure 12a.…”
Section: Crack Expansion Of the Pdc Layermentioning
confidence: 91%
“…Other important research that has shown the influences of the T-stress includes: Zhang et al [10], which used numerical manifold method (NMM) is employed to calculate the T-stress for two-dimensional functionally graded material (FGM) having numerous cracks. Noritaka et al [11] has resulted the T-stress might open micro-branches in the mist region. For the bending and tension load, Hancock [12] determined that T decreases with escalating crack length.…”
Section: Introductionmentioning
confidence: 99%
“…Most recently, Mecholsky et al [9] studied the relationship between fractography, fractal analysis, and crack branching in brittle materials. Nakamura et al [10] researched the effect of the stress field on crack branching in brittle material. Chen et al [11] studied the influence of micro-modulus functions on peridynamics simulation of crack propagation and branching in brittle materials.…”
Section: Introductionmentioning
confidence: 99%