Effect of the incorporation of interfacial elements on the thermophysical properties of Cu/VGCNFs composites

Bárcena, J.; Cortázar, Maider García de; Seddon, Richard; Lloyd, J.C.; Torregaray, A.; Coleto, J.

doi:10.1016/j.compscitech.2010.05.025

Cited by 8 publications

(3 citation statements)

References 14 publications

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“…The thermal conductivity of Al/CNF composites has growth up with the increase of compacting temperature independently of the chemical composition, however much smaller as compare with the samples prepared by cold pressing and sintering (150 -190 W/(m•K)). Low thermal conductivity of aluminum/CNF composites is 25 -100 W/(m•K), associated with the presence of thermal barrier at the filler -matrix interface that is also noted in [12,13]. Increasing the thermal resistance provided by boundaries forming carbide and/or oxide as the thermal conductivity of such compounds significantly lower the conductivity of pure metal and is in the range of 10 to 40 W/(m•K) [14] for carbides, and is about 30 W/(m•K) for alumina [9].…”

Section: Resultsmentioning

confidence: 90%

Hybrid Aluminum Composite Materials Based on Carbon Nanostructures

Koltsova

Nasibulin

Shamshurin

et al. 2015

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We investigated formation of carbon nanofibers grown by chemical deposition (CVD) method using an acetylenehydrogen mixture on the surface of micron-sized aluminum powder particles. To obtain uniform distribution of the carbon nanostructures on the particles we deposited nickel catalyst on the surface by spraying from the aqueous solution of nickel nitrate. It was found that increasing the time of the synthesis lowers the rate of growth of carbon nanostructures due to the deactivation of the catalyst. The Raman spectroscopy measurements confirm the presence of disordered carbon corresponding to CNFs in the specimen. X-ray photoelectron spectroscopy showed the presence of aluminum carbide in the hot pressed samples. An aluminum composite material prepared using 1 wt.% CNFs obtained by uniaxial cold pressing and sintering showed 30 % increase in the hardness compared to pure aluminum, whereas the composites prepared by hot pressing showed 80 % increase in the hardness. Composite materials have satisfactory ductility. Thus, the aluminum based material reinforced with carbon nanostructures should be appropriate for creating high-strength and light compacts for aerospace and automotive applications and power engineering.

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Section: Resultsmentioning

confidence: 90%

Hybrid Aluminum Composite Materials Based on Carbon Nanostructures

Koltsova

Nasibulin

Shamshurin

et al. 2015

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“…However, this research is rarely done at present. On the other hand, it has been suggested that the major problem in the development of the Cu matrix composites containing carbon-based fillers is the absence of chemical reaction between carbon and copper, which will lead to a weak mechanical bonding and a bad transfer of properties between reinforcement and matrix [5][6][7]. In the present work, chromium, a carbide forming element, is coated on the surface of such milled graphite fibers in order to improve the interfacial bonding.…”

Section: Introductionmentioning

confidence: 96%

Fabrication and Characterization of Chromium-Coated Graphite Fibers Reinforced Copper Matrix Composites

Zhang

2012

AMR

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Milled form of mesophase pitch-based graphite fibers were coated with a chromium layer using chemical vapor deposition technique, and Cr-coated graphite fiber/Cu composite with 50 vol.% fibers was fabricated by hot-pressing. The composite was characterized with scanning/transmission electron microscopies and by measuring thermal properties, including thermal conductivity and coefficient of thermal expansion (CTE). The results showed that the milled fibers were preferentially oriented in a plane perpendicular to the pressing direction, leading to anisotropic thermal properties of the composite. The Cr coating reacted with graphite fiber and formed to a continuous and uniform Cr3C2layer. This carbide layer established a good metallurgical interfacial bonding in the composite, which can improve the thermal properties effectively. The in-plane thermal conductivity and CTE of the composite reached to 392 W/mK and 6.5 ppm/K respectively, making the composite suitable for being electronic packaging materials.

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“…Metallic copper and its alloys are coated by electroless plating method as thin films or particles on various substrate materials. These include glass, polymers, metals, metal‐nitride, micro and nano SiC, carbon nanotubes, carbon nanofibers, natural pollen particles and Al 2 O 3 particles . On the other hand, very few studies have been carried out on the wood.…”

Section: Introductionmentioning

confidence: 99%

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

Amer

Mrad

Naddaf

2016

Surface & Interface Analysis

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Copper films were coated on beech wood substrates by electroless plating method. The influence of bath temperature on the copper films properties was studied by varying the bath temperatures 25, 35, 45 and 55 °C. Scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD) pattern, X‐ray photoelectron spectroscopy (XPS), micro Raman spectroscopy and contact angle measurements were used to both characterize the physical and chemical copper films properties and understand the influence of bath temperature on the wettability of copper surface. In our studies, we have found that the gained copper mass significantly increased at 55 °C. The crystalline nature of the coated copper was confirmed by XRD. The presence of Cu2O and CuO was observed by XPS and micro Raman techniques, which confirms the oxidization of the coated copper surface. Also these characterization techniques have shown the big influence of bath temperature on the morphology, grain size, chemical composition and the film thickness of the coated copper. The wettability was highly influenced by increasing CuO on the coated copper, which is increased by the bath temperature. The contact angle measurements have demonstrated the influence of C―O, O―CO and CuO components of the surface on the wettability of the samples. Copyright © 2016 John Wiley & Sons, Ltd.

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Effect of the incorporation of interfacial elements on the thermophysical properties of Cu/VGCNFs composites

Cited by 8 publications

References 14 publications

Hybrid Aluminum Composite Materials Based on Carbon Nanostructures

Hybrid Aluminum Composite Materials Based on Carbon Nanostructures

Fabrication and Characterization of Chromium-Coated Graphite Fibers Reinforced Copper Matrix Composites

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

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