Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy

Zhang, Lei; Yang, Wenchao; Feng, Jia; Qin, Wei; Qi, Da; Song, Shijie; Zhan, Yongzhong

doi:10.1016/j.jmrt.2023.07.260

Cited by 3 publications

(1 citation statement)

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“…CeO 2 nanoparticles, due to their excellent stability in high-temperature and high-pressure environments, as well as outstanding ionic and electronic conductivity, have been widely used in the fields of energy and chemical engineering 16 , 17 . Li et al 18 mixed CeO 2 nanoparticles with Sn57Bi1Ag solder paste to successfully prepare SBA- x CeO 2 composite solder with different CeO 2 nanoparticle contents.…”

Section: Introductionmentioning

confidence: 99%

Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints

Chen,

Zhang,

Fan

et al. 2024

Sci Rep

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To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the microstructure and properties of Sn58Bi/Cu solder joints under electromigration were investigated. The study results demonstrate that the addition of 0.125 ~ 0.5 wt% CeO2 nanoparticles refines the eutectic microstructure of Sn58Bi solder alloy. At an addition amount of 0.5 wt%, the composite solder alloy exhibits the maximum tensile strength of 68.9 MPa, which is 37% higher than that of the base solder. CeO2 nanoparticle-reinforced Sn58Bi solder can achieve excellent solderbility with Cu substrates and the joints can significantly inhibit the growth of the anodic Bi-rich layer, which is responsible for electromigration. With the extension of current stressing time, Bi-rich and Sn-rich layer are respectively formed on the anode and cathode in the joints. The intermetallic compound (IMC) layer grows asymmetrically, transitioning from a fan-shaped morphology to a flattened structure at the anode and to a thickened mountain-like morphology at the cathode. Adding the CeO2 nanoparticles helps to mitigate the decrease in mechanical performance caused by electromigration damage during current application to some extent. Over the current stressing period of 288 ~ 480 h, the fracture position shifts from the anodic IMC/Bi-rich interface to the cathodic Sn-rich/IMC interface. The fracture mechanism transitions from a brittle fracture characterized by plate-like cleavage to a ductile–brittle mixed fracture with fine dimples and cleavage.

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Section: Introductionmentioning

confidence: 99%