Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints
Weiming Chen,
Keke Zhang,
Yuchun Fan
et al.
Abstract:To mitigate the decrease in mechanical performance of Sn58Bi/Cu solder joints resulting from electromigration-induced damage. The CeO2 nanoparticles were incorporated into Sn58Bi solder by a melt-casting method, and their effects on the microstructure and properties of Sn58Bi/Cu solder joints under electromigration were investigated. The study results demonstrate that the addition of 0.125 ~ 0.5 wt% CeO2 nanoparticles refines the eutectic microstructure of Sn58Bi solder alloy. At an addition amount of 0.5 wt%,… Show more
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