Effect of temperature and alloying elements (Fe and Bi) on the electrical resistivity of Sn–0.7Cu solder alloy

Abstract

In this paper, we investigated the electrical resistivity as a function of temperature of the Sn-0.7Cu solder alloy with the addition of Fe and Bi. The electrical resistivity were characterized by the four-point probe method. Apparent change in electrical resistivity was witnessed by the addition of both Fe and Bi. At room temperature, the electrical resistivity was found to be increased with the addition of Fe, as well as a further increase with the addition of Bi. Fe and Bi modified Sn-0.7Cu alloys also experienced the similar increasing trend when they were subjected to higher temperatures within the range of 300-423 K. Chemical state of Sn was analyzed by means of X-ray photoelectron spectroscopy (XPS). The results revealed the presence of Sn in Sn 2+ , Sn 4+ and state of metallic Sn. With the addition of Fe & Bi, a substantial decrease was observed in the atomic percent of the Sn 4+ chemical state. X-ray diffraction (XRD) was performed on the alloys. The XRD pattern showed disturbance in the 2 theta values with the addition of Bi. The disturbance confirmed the presence of stress and imperfections in the crystal lattice. Field emission scanning electron microscope (FESEM) micrographs revealed the formation of the FeSn 2 intermetallic compound with the addition of Fe. However, the addition of Bi promotes the formation of solid solution and goes into primary b-Sn dendrites. Microstructural changes, shifts in the chemical state of Sn and a disturbance in the XRD peaks resulting from the addition of Fe and Bi have been correlated to the variation in electrical resistivity.

Critical Review on the Physical Properties of Gallium-Based Liquid Metals and Selected Pathways for Their Alteration

“…204−206 The effect of the alloying element was related to the size mismatch, where alloying atoms with atom radii 15% or larger than the pure metal lead to a grave effect on the electrical conductivity, to a higher degree of disorder in the structure, and to weaker interatomic interactions. 78,204,206 A similar effect of alloying can be observed for the liquid metals EGaIn and Galinstan, which show lower electrical conductivities than pure liquid Ga. The addition of In atoms is especially envisaged to reduce electrical conductivity due to a lower charge density at the indium atoms (see Figure 10b).…”

“…The liquid metal mercury shows a rather low electrical conductivity and the electrical conductivity is increased by alloying with most metals, such as In; both were attributed to a pseudopotential by Evans. , In contrast, by alloying, the electrical conductivity of other pure metals is typically lowered according to Mathiesson’s rule. − The effect of the alloying element was related to the size mismatch, where alloying atoms with atom radii 15% or larger than the pure metal lead to a grave effect on the electrical conductivity, to a higher degree of disorder in the structure, and to weaker interatomic interactions. ,, A similar effect of alloying can be observed for the liquid metals EGaIn and Galinstan, which show lower electrical conductivities than pure liquid Ga. The addition of In atoms is especially envisaged to reduce electrical conductivity due to a lower charge density at the indium atoms (see Figure b) .…”

Electrical resistivity of Sn–3.0Ag–0.5Cu solder joint with the incorporation of carbon nanotubes

“…Based on the results, it proves that the existence of impurities in the solder matrix will increase the electrical resistivity as follow the Matthiessen theory. 33 Comparison of current work with Nai et al 18 revealed that electrical resistivity of the SAC305-CNT solder joint is higher compared to the electrical resistivity of SAC305-CNT solder bulk. Different values of electrical resistivity by addition of CNT are mainly due to the form type of solder, types of CNT used, and the processing methods used.…”

Effect of Ni-MOF Derivatives on the Electrochemical Corrosion Behavior of Sn-0.7Cu Solders

“…When the amount reached a certain level, the passive film was broken down. The dissolution of Sn was accelerated by Cl − , which led to the formation of the complexes of SnCl − 3 and SnCl 2− 6 [32]. Thus, the corrosion current increased sharply.…”