2002
DOI: 10.1016/s0257-8972(02)00139-1
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Effect of tartrate content on aging and deposition condition of copper–tin electrodeposits from a non-cyanide acid bath

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Cited by 38 publications
(26 citation statements)
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“…That is consisting of copper and tin metals. The variations of tin composition significantly affect and improve the alloy characteristics and mechanical properties [1], such as ductility, solderability [2], low surface tension [3] and increasing of Sn content provides a higher corrosion resistance. The electroplated Cu-Sn alloys are used for decorative finishing of various metallic articles [4], industrially for metal coatings and microelectronic applications [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…That is consisting of copper and tin metals. The variations of tin composition significantly affect and improve the alloy characteristics and mechanical properties [1], such as ductility, solderability [2], low surface tension [3] and increasing of Sn content provides a higher corrosion resistance. The electroplated Cu-Sn alloys are used for decorative finishing of various metallic articles [4], industrially for metal coatings and microelectronic applications [5,6].…”
Section: Introductionmentioning
confidence: 99%
“…The tartrate ion is an organic additive in the electrodeposition process of different metals and alloys, as have been reported in the literature 17,18 . Sodium tartrate was used as an additive for the electrodeposition of Cu-Sn alloys from an acid bath, producing levelled coatings 19,20 . The tartrate ion is known as a complexing agent for Cu (II) and Sn (II) ions.…”
Section: Introductionmentioning
confidence: 99%
“…The cyanide baths are used frequently in commercial electrodeposition of Cu-Sn alloys and give high-quality deposits, but they cause environmental problems related to the use and disposal of cyanide. [4,[17][18][19] Citrate, thiocyanate, tartrate, and pyrophosphate baths are used for Cu-Sn electroplating, but these electrolytes have several drawbacks and safe alternatives have been sought. [4,15,20] Nevertheless, tripolyphosphate (TPP) electrolytes that have already been employed for electroplating of high-quality bronze coatings are suitable for Cu-Sn powder electrodeposition.…”
Section: Introductionmentioning
confidence: 99%
“…The leading selection of TPP as complexing agent is a result of its nontoxic nature, low cost, and ability to compose stable soluble complexes with copper and tin ions. [4,21] Carlos et al [17] have investigated the effects of tartrate addition on chemical stability of an acidic Cu-Sn bath. They found that the deposition efficiency was changed with the presence of tartrate as an additive in Cu-Sn baths.…”
Section: Introductionmentioning
confidence: 99%