Effect of Ta incorporation on the microstructure, electrical and optical properties of Hf1−xTaxO high-k film prepared by dual ion beam sputtering deposition
“…Cs-O-Si, similar to the Si-O-M species [37][38][39][40], the bind energy 226 near 533 eV was due to Si-O (Si-O-Si, Si-O-H) from SiO 2 support 227 [41]. …”
“…Cs-O-Si, similar to the Si-O-M species [37][38][39][40], the bind energy 226 near 533 eV was due to Si-O (Si-O-Si, Si-O-H) from SiO 2 support 227 [41]. …”
“…annealing located at around 281, which originates from the monoclinic structure of HfO 2 [21]. It is believed that the high leakage current of crystalline samples is mainly due to grain boundaries that serve as high leakage paths of the gate oxide layer [22]. The same phenomenon occurs for HfTiO/HfGdO samples.…”
“…Yet, amongst all these issues, the interface properties and their thermal instabilities need to be resolved firstly [64][65][66][67][68][69][70][71][72]. Transition metal (TM) or rare-earth metal (RE) based high-k dielectrics are extrinsic materials to the substrate silicon.…”
Section: Subnanometer Eot Leakage Current and High-k Instabilitiesmentioning
confidence: 99%
“…It was proposed that the oxygen in W may diffuse into the La 2 O 3 film to fill up the oxygen vacancies there. Oxygen vacancies are the major defect centers in La 2 O 3 which result in several instability issues and enhance the gate leakage current [59][60][61][62][63][64][65][66][67][68][69][70][71]. Post-metallization annealing may cause an reverse effect.…”
“…Most of the high-k silicides are conductive. The interfacial silicide layer would not affect the EOT but the interface metal-Si bonding is one of the interface trap precursors and results in the channel mobility degradation and in other instabilities [2,[59][60][61][62][63][64][65][66][67][68][69][70]. Most of the high-k materials, including hafnium oxide and lanthanum oxide are only marginally stable against the formation of silicates.…”
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