Effect of structure transformation on the creep characteristics of Sn–3wt% Bi alloy

El‐Rehim, A. F. Abd

doi:10.1016/j.jallcom.2006.09.021

Cited by 5 publications

(2 citation statements)

References 22 publications

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“…28,29 One of the most common ways to identify the micromechanisms responsible for creep process is to establish the creep activation energy. 30 The activation energy of steady state creep was calculated for both alloys from the slopes of the straight lines relating ln : e st and 1000/T t (see Fig. 3).…”

Section: D~0mentioning

confidence: 99%

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

El‐Rehim

Zahran

2014

Materials Science and Technology

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The present study was undertaken to investigate the influence of aging temperature on the creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys at testing temperatures ranging from 333 to 363 K under constant stress of 7·80 MPa. The steady state creep rate was found to increase continuously with increasing aging temperature at all testing temperatures. Results show that addition of Bi to the binary Sn–Ag solder alloy led to a significant increase in the strength and improvement in the creep resistance. The activation energy for the creep process of Sn–Ag and Sn–Ag–Bi solder alloys was found to have an average value of 36 and 45 kJ mol−1 respectively. This might be characterised by diffusion of Ag in Sn. The microstructure of the aged samples for both alloys examined by X-ray diffraction measurements supported the improvement in the creep resistance for Sn–Ag alloy by adding a small trace of Bi.

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Section: D~0mentioning

confidence: 99%

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

El‐Rehim

Zahran

2014

Materials Science and Technology

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“…The calculated activation energy can be used to identify the mechanisms involved during creep deformation. It can be concluded that the mechanism corresponding to the creep behavior of high stress region is cross slipping dislocation or dislocation pipe diffusion [121] while the mechanism for the creep behavior of at low stress region is glide dislocations [126].…”

Section: Thermal Cycling Creepmentioning

confidence: 99%

Atomic probe tomography and creep deformation studies of highly dynamic metallic systems: copper-zirconium based metallic glass alloys and tin-based alloy

Yipyintum

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The early crystallization process of a Cu-Zr binary metallic glass was investigated by transmission electron microscopy (TEM) and atomic probe tomography (APT). The microstructural analysis was carried out using different characterization methods to see if the phase separation in different chemical compositions and chemical short-range orders were investigated by applying heat treatment under argon atmosphere in differential scanning calorimetry (DSC) chamber. Such a difference in the atomic arrangement of a given amorphous metallic structure is important, the actual characterization of such small difference is not practically easy. For the reason that there is an effect of the sample preparation method which could lead to a misinterpreted of the observation since it could cause artifacts. The selection of a appropriate sample preparation method is important in direct observation of the artifact-free amorphous microstructure, since Cu-Zr binary metallic glass is promptly oxidized and hydrogenated. By prepared the sample using focus ion beam scanning electron microscope (FIB-SEM) and ion milling, oxide and hydride contamination on the sample could observe. Even the low-energy ion milling with liquid nitrogen cooling without careful measured parameters of TEM and APT could also create oxide and hydride of the alloys. Creep deformation of Sn-1 wt% Bi was studied and compared by conventional tensile creep and nanoindentation creep. The mechanisms corresponding to creep behavior were demonstrated from the two techniques. The creep equation was able to explain the lapping process parameters. The objective of this study is to understand highly dynamic metallic system such as low melting point alloy and metallic glass alloy. This could be further applied and explained in wide range of applications.

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Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy

El‐Rehim

2007

J Mater Sci

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Effect of structure transformation on the creep characteristics of Sn–3wt% Bi alloy

Cited by 5 publications

References 22 publications

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

Atomic probe tomography and creep deformation studies of highly dynamic metallic systems: copper-zirconium based metallic glass alloys and tin-based alloy

Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy

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