Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy

El‐Rehim, A. F. Abd

doi:10.1007/s10853-007-2312-4

Cited by 20 publications

(12 citation statements)

References 27 publications

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“…The creep rate is approximately constant in the second stage of creep, referred to as steady-state or secondary creep. Once the creep rate has accelerated to the fracture point, it becomes a tertiary creep [27].…”

Section: Resultsmentioning

confidence: 99%

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

2021

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The purpose of this work is to explore the impact of 0.5, 1.5, 2.5 and 3.5 wt.% Bi additions on the microstructure and mechanical performance of Sn-1Ag-0.5Cu solder alloy. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were utilized to examine the microstructure of the present solders. Creep measurements have been used for the preliminary assessment of mechanical properties. The steady-state creep rate, έst, diminished as the Bi’s concentration increased and reached 2.5 wt.%, with this trend altering above this point. Furthermore, increasing the aging or testing temperature caused the έst values to increment for all the investigated solders. έst variations with different Bi content and aging temperature were observed by examining the Sn-Ag-Cu solders’ structural evolutions. The mean value of the activation energy of all investigated solder alloys was found to be ∼52 kJ/mol. This value is appropriate to that quoted for the dislocation climb through the core diffusion as the dominant operating mechanism. The XRD findings supported the microstructure and lattice parameters variations with both aging temperatures and bismuth concentrations.

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Section: Resultsmentioning

confidence: 99%

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

2021

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“…2 that: (i) all the creep curves exhibit normal creep behaviour while the strain level increases as either the magnitude of s cy or n of CSR increases (ii) the creep rate is enhanced under CSR as compared with static stress of same peak stress (iii) the sequence of curves with respect to working temperatures is regular. The transient creep stain e tr can be represented by the relation 22,23 In the present investigation, a threshold cyclic stress amplitude, (s cy ) th for CCA is defined as the steady state CSR amplitude applied to peak stress to initiate the CCA. To obtain the value of (s cy ) th , extrapolation of each line in Fig.…”

Section: Resultsmentioning

confidence: 99%

“…The value of 171 kJ mol 21 for activation energy of the steady state stage can be attributed to dislocation climb controlled process. 40 The relation that relates the transient and steady state creep stages is 15,23…”

Section: Discussionmentioning

confidence: 99%

Effect of cyclic stress reduction on high temperature creep characteristics of solid solution Al−2·9 wt-Mg alloy

El‐Rehim¹,

Mahmoud²

2011

Materials Science and Technology

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Creep characteristics of solid solution Al−2·9 wt-Mg alloy have been investigated under the effect of cyclic stress reduction of different amplitudes (12·47−26·18 MPa) and frequencies (0·20−0·44 Hz) at different working temperatures ranging from 533 to 593 K. It was found that increasing both amplitude and frequency of cyclic stress reduction resulted in an increase in both transient and steady state creep stages. The enhancement of creep rate was observed above either a threshold stress or a threshold frequency. The activation energy values of the mechanisms operating in both transient and steady state creep stages were found to be 130 and 171 kJ mol−1 respectively.

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“…In general, all the data can be divided into two stress regimes, with the stress exponent n ranging from 4 to 7 in the low stress regime, and from 7 to 12 in the high stress regime. In most cases, the activation energy Q has been thought to be associated with dislocation core diffusion, although in some cases, it falls well below the range of 40-65 kJ mol 21 for core diffusion in pure Sn. Some of these discrepancies may be attributed to solidification rate dependent microstructural differences in the experimental samples due to differences in sample size (bulk versus small joints).…”

Section: Introductionmentioning

confidence: 99%

“…[2][3][4][5] Among these new lead free solders, Sn-3?5 wt-%Ag has emerged as a promising alternative because of its higher strength and superior resistance to creep and thermal fatigue when compared to eutectic Pb-Sn solder [6][7][8][9][10] but a relatively high melting point and poor wettability, which require ternary elements, such as Cu, Bi, In or Zn. 11 Creep deformation behaviour of Sn-3?5 wt-%Ag alloy was studied 1 in the temperature range of ambient to 473 K. The activation energy for creep was determined to be 60?7 kJ mol 21 . Based on the activation energy value, it is suggested that the creep deformation mechanisms are dislocation climb creep controlled by lattice diffusion in Sn-3?5Ag alloy.…”

Section: Introductionmentioning

confidence: 99%

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

El‐Rehim

Zahran

2014

Materials Science and Technology

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The present study was undertaken to investigate the influence of aging temperature on the creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys at testing temperatures ranging from 333 to 363 K under constant stress of 7·80 MPa. The steady state creep rate was found to increase continuously with increasing aging temperature at all testing temperatures. Results show that addition of Bi to the binary Sn–Ag solder alloy led to a significant increase in the strength and improvement in the creep resistance. The activation energy for the creep process of Sn–Ag and Sn–Ag–Bi solder alloys was found to have an average value of 36 and 45 kJ mol−1 respectively. This might be characterised by diffusion of Ag in Sn. The microstructure of the aged samples for both alloys examined by X-ray diffraction measurements supported the improvement in the creep resistance for Sn–Ag alloy by adding a small trace of Bi.

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Effect of grain size on the primary and secondary creep behavior of Sn–3 wt.% Bi alloy

Cited by 20 publications

References 27 publications

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

Effect of cyclic stress reduction on high temperature creep characteristics of solid solution Al−2·9 wt-Mg alloy

Effect of aging treatment on microstructure and creep behaviour of Sn–Ag and Sn–Ag–Bi solder alloys

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