Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy

Abstract

The purpose of this work is to explore the impact of 0.5, 1.5, 2.5 and 3.5 wt.% Bi additions on the microstructure and mechanical performance of Sn-1Ag-0.5Cu solder alloy. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were utilized to examine the microstructure of the present solders. Creep measurements have been used for the preliminary assessment of mechanical properties. The steady-state creep rate, έst, diminished as the Bi’s concentration increased and reached 2.5 wt.%, with this trend altering above this point. Furthermore, increasing the aging or testing temperature caused the έst values to increment for all the investigated solders. έst variations with different Bi content and aging temperature were observed by examining the Sn-Ag-Cu solders’ structural evolutions. The mean value of the activation energy of all investigated solder alloys was found to be ∼52 kJ/mol. This value is appropriate to that quoted for the dislocation climb through the core diffusion as the dominant operating mechanism. The XRD findings supported the microstructure and lattice parameters variations with both aging temperatures and bismuth concentrations.

Synergetic role of Ni and GOns to improve the microstructure and mechanical creep rate of Sn-5.0Sb-0.7Cu solder alloy

“…These values of activation energies are smaller than those for the lattice self-diffusion mechanism in the Sn matrix (∼100 kJ mol −1 ). The obtained values of activation energies are close to 0.6 times the activation energy of the lattice self-diffusion and are in excellent consistency with those reported for dislocation pipe diffusion [37,[49][50][51][52]. The values of cooling rate, size of β-Sn phase, stress exponent (n) and activation energy (E) for SSC-507 alloy in this study compared with a ln st e and lns at different testing temperature for SSC SSC-507, SSC-0.1Ni, and SSC-0.1Ni-0.1GOns solder alloys.…”

Enhancing Mechanical Properties of Low Alloy Steel through Novel Molten Bi-Ga Austempering

“…Research on computational modeling and experiments with Ti alloys [18] demonstrate how properties like strength, ductility, and corrosion resistance can be optimized by identifying ideal alloy compositions and microstructures. Several more studies look into the microstructure and properties of adding alloying elements like Bi to metals like steels, solders, and liquid metal alloys [19], [20], and [21]. Bi has been found to refine grain structures, provide solid solution strengthening, and form protective intermetallic compounds, leading to improved strength, machinability, and corrosion performance.…”