Effect of Strain Rate on Joint Strength and Failure Mode of Lead-Free Solder Joints

Shear strength and fracture mechanism for full Cu-Sn IMCs solder joints with different Cu3Sn proportion and joints with conventional interfacial structure in electronic packaging

“…In literature works (Lee et al , 2003; Lin et al , 2018; Zhang and Zhang, 2009; Zhang et al , 2015), it was found that fracture happened in the interfacial region when shear or tensile tests were conducted on solder joints. This meant the strength of interfacial region determined the strength of joints.…”

“…The traditional soldering condition refers to the interconnected height (solder thickness) of several hundreds of micrometers, the soldering time of merely several minutes and no application of pressure. Under the traditional soldering condition, joints with the conventional interfacial structure of Cu/Cu-Sn IMCs (Cu 6 Sn 5 , Cu 3 Sn)/solder/Cu-Sn IMCs (Cu 6 Sn 5 , Cu 3 Sn)/Cu are obtained (Gao et al , 2015; Koleňák and Kostolný, 2015; Koleňák et al , 2016; Li et al , 2016; Ma et al , 2017; Lin et al , 2018; Lee et al , 2003; Ma et al , 2014; Sun et al , 2017; Wei et al , 2015; Xiao et al , 2013; Zhao et al , 2016; Zhang and Zhang, 2009; Zhang et al , 2015). Actually, the relevant studies about solder joints mainly focus on joints with the conventional interfacial structure.…”