2019
DOI: 10.1108/ssmt-08-2018-0021
|View full text |Cite
|
Sign up to set email alerts
|

Effect of stearic acid coating on anti-oxidation property of Sn-Ag-Cu solder powder

Abstract: Purpose The purpose of this study is to develop a monolayer surface coating of stearic acid on Sn-Ag-Cu solder powder to limit oxidation. Design/methodology/approach Stearic acid was adsorbed onto Sn-Ag-Cu solder powder through liquid-phase adsorption. The isotherm of adsorption was measured and then the microstructure of coated powder was characterized by scanning electron microscopy, transmission electron microscopy, X-ray photoelectron spectroscopy and Fourier-transform infrared spectroscopy. Findings T… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2020
2020
2024
2024

Publication Types

Select...
3
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(1 citation statement)
references
References 16 publications
0
1
0
Order By: Relevance
“…Similar soldering problems can arise if the particles in the solder paste are oxidised, that is why a monolayer surface coating of stearic acid was developed by Peng et al to increase the anti-oxidation property of solder pastes [6]. Further improvements and process optimisation in this field can be obtained, e.g.…”
Section: Introductionmentioning
confidence: 97%
“…Similar soldering problems can arise if the particles in the solder paste are oxidised, that is why a monolayer surface coating of stearic acid was developed by Peng et al to increase the anti-oxidation property of solder pastes [6]. Further improvements and process optimisation in this field can be obtained, e.g.…”
Section: Introductionmentioning
confidence: 97%