Effect of CNTs on the intermetallic compound growth between Sn solder and Cu substrate during aging and reflowing

Influences of silicon carbide nanowires’ addition on IMC growth behavior of pure Sn solder during solid–liquid diffusion

“…Additionally, researchers usually selected micro/nano-metric materials as strengthened additives added into pure Sn solder to promote the reliability of solder joints, such as single metallic particles or elements (Ag, Bi, Cu, etc.) [14][15][16] and carbon-based materials [17]. Sun et al [18] demonstrated that Cu atoms in Cu substrate could react with Sn atoms in Sn solder rapidly at high temperature and two different IMC layers of the typical Cu 6 Sn 5 and Cu 3 Sn were observed at the interface as the transient liquid phase bonding time increased.…”

“…Meanwhile, micrometric CuZnAl particles added to Sn solder could absorb on the surface of Sn atoms, prohibiting the Sn and Cu atoms from reacting and then refraining interfacial surface IMC layer growth of Cu/Sn-0.5CuZnAl/Cu. Also, there were studies [17,19] that indicated that 0.075 wt% carbon nanotubes (CNTs) or 0.7 wt% Cu nanoparticles as strengthening phases introduced into Sn solder decreased the interfacial Cu 6 Sn 5 IMC thickness mostly. Moreover, Ag 3 Sn nanoparticles added to Sn solder could restrain the overgrowth of the interfacial Cu 6 Sn 5 IMC in that it would be aggregated on IMC surface and prevent Sn and Cu ions from diffusing at the solder/substrate interface [14].…”