Effect of Solder Voids on Thermal Performance of a High Power Electronic Module

Biswal, Laxmidhar; Krishna, Arvind; Sprunger, D.

doi:10.1109/eptc.2005.1614460

Cited by 21 publications

(6 citation statements)

References 2 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Hence, the need to infer that voids may have impacted the amount of deformation observed in this investigation. Also, the experimental work by Biswal et al (2005), suggested that the function of an electronic module could be highly impacted by the amount of solder voids present in the system.…”

Section: Total Deformationmentioning

confidence: 99%

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Ekpu

2021

SSMT

View full text Add to dashboard Cite

Purpose In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic devices to bridge the topologies that exists between a heat sink and the flip chip assembly. Therefore, this study aims to investigate the reliability of SAC405 and SAC396 in a microelectronics assembly. Design/methodology/approach In this paper, SnAgCu solder alloys (SAC405 and SAC396) were used as the TIMs. The model, which comprises the chip, TIM and heat sink base, was developed with ANSYS finite element analysis software and simulated under a thermal cycling load of between −40°C and 85°C. Findings The results obtained from this paper were based on the total deformation, stress, strain and fatigue life of the lead-free solder materials. The analyses of the results showed that SAC405 is more reliable than SAC396. This was evident in the fatigue life analysis where it was predicted that it took about 85 days for SAC405 to fail, whereas it took about 13 days for SAC396 to fail. Therefore, SAC405 is recommended as the TIM of choice compared to SAC396 based upon the findings of this investigation. Originality/value This paper is centred on SnAgCu solders used as TIMs. This paper demonstrated that SAC405 is a reliable solder TIM. This can guide manufacturers of electronic products in deciding which SAC solder to apply as TIM during the assembly process.

show abstract

Section: Total Deformationmentioning

confidence: 99%

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Ekpu

2021

SSMT

View full text Add to dashboard Cite

show abstract

“…This represents a variation in manufacturing. The impact of voids on thermal impedance depends on the type and location of the void and is nonlinear due to spreading resistance [21,22]. Thus, we do not have a direct correlation between solder void fraction and thermal impedance.…”

Section: Variational Parametersmentioning

confidence: 99%

Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

Vlahinos¹,

O’Keefe

2009

Volume 5: Electronics and Photonics

View full text Add to dashboard Cite

This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor, or IGBT. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup. INTRODUCTIONPower inverters are key components of the electric traction drives of hybrid electric, plug-in hybrid electric, fuel cell electric, and pure electric vehicles [1, 2]. Research and development of power inverters is currently focused on reducing the cost, weight, and volume of the technology while maintaining and/or increasing reliability [1, 2]. If the research goals related to cost, weight, volume, and reliability can be met, more advanced vehicles can enter the marketplace and reduce the amount of petroleum required for transportation.Current-generation inverter designs used in today's hybrid vehicles are built on proven technology that has demonstrated high reliability. In contrast, the next generation of inverter concepts combines new materials, new heat transfer methods, and new packaging concepts under increased loads and in smaller spaces. Furthermore, there is interest in expanding the range of temperatures and stresses under which these technologies can operate [3, 4]. For these new technologies and conditions, reliability is, as yet, unproven.In a production environment, reliability data can be obtained from statistical measures of empirical data or from product testing. However, design changes during production to fix reliability problems are quite expensive. In contrast, during the early phases of research, design changes are cheap to make. However, prototypes may not even be available. Therefore, at the very earliest stages of design, other methods must be used to estimate reliability (see page 3 of [5] for further discussion).

show abstract

“…For a given technology in power application, an empiric level of 5% is generally used [9][10]. In reality, the void criteria levels are much more complicated to determine because they vary with void characteristics such as geometry, position, distribution [11][12][13][14][15][16]. It becomes crucial to optimize void thresholding in taking into account the electrothermal couplings.…”

Section: Introductionmentioning

confidence: 99%

“…The previous studies introduced thermal modeling in which the power dissipated in the chip is defined by a homogenous surface or a volume heat source [11][12][13][14][15][16]. In reality, the device behavior in its surrounding environment is a complex thermal, electrical and mechanical coupling phenomena, and requires multi-physics modeling.…”

Section: Introductionmentioning

confidence: 99%

Electrothermal Evaluation of Single and Multiple Solder Void Effects on Low-Voltage Si MOSFET Behavior in Forward Bias Conditions

Tran¹,

Dupont

Khatir

2017

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

Solder void thermal effects on power module performance and reliability were investigated long time ago. The final goal is to determine void acceptability criteria or to remove them. Our approach is not to offer a more efficient method for neglecting void formation, but to suggest a method for optimizing void thresholding from multiphysical viewpoint. The major achievement is in the complete combination of modeling, experiments and optimization for void effect evaluation purpose. Especially, it has been introduced for the first time a real new highly coupled and detailed 3D-FEM electrothermal model of lowvoltage silicon MOSFET and the bonding wires in steady state. For single void case, the simulation results highlight local void effects on thermal performance of MOSFET in void area. However, no significant consequence on electrical performance is observed. Besides, the model shows a high dependence between void effects and back side metallization parameters. Electrical and thermal measurements performed on various single void configurations of experimental MOSFET prototypes offer a good agreement with numerical results. The study is then expanded to multi-voids case. The criticality of multi-voids corresponds to that of the most critical single void if the voids are not coalesced. These results offer an idea for a more optimized void inspection method in production line.

show abstract

Effect of Solder Voids on Thermal Performance of a High Power Electronic Module

Cited by 21 publications

References 2 publications

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Reliability analysis of SnAgCu lead-free solder thermal interface materials in microelectronics

Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

Electrothermal Evaluation of Single and Multiple Solder Void Effects on Low-Voltage Si MOSFET Behavior in Forward Bias Conditions

Contact Info

Product

Resources

About