Abstract:Purpose
In microelectronics industry, the reliability of its components is a major area of concern for engineers. Therefore, it is imperative that such concerns are addressed by using the most reliable materials available. Thermal interface materials (TIMs) are used in electronic devices to bridge the topologies that exists between a heat sink and the flip chip assembly. Therefore, this study aims to investigate the reliability of SAC405 and SAC396 in a microelectronics assembly.
Design/methodology/approach
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